DETAILED ACTION
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-5 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Soyano, US 2016/0035646.
Regarding claim 1, Soyano shows a structure, comprising: a wiring substrate (substrate 11-2C in FIG. 9a); a device (chip 3 and [0058]) disposed on and electrically connected to the wiring substrate (substrate 11-2c) ; an insulating encapsulation (sealing 9) disposed on the wiring substrate and laterally encapsulating the device (chip 3); a lid disposed ( case 72 as shown in FIG. 21) on the device and the insulating encapsulation; a reinforcement structure ( feed block 4 and [0060]) embedded in the insulating encapsulation ( sealing 9); and fastening elements (lead pins 7) penetrating through the lid ( case 72), wherein the lid is fastened to the reinforcement structure through the fastening elements (see FIG. 22 with respect to FIG. 9a).
Regarding claim 2, Soyano shows a structure, further comprising: an adhesive ([0139]) disposed between the insulating encapsulation (sealing 9) and the lid (lid 72); and a thermal interface material disposed between the device and the lid (see FIG. 9a with respect to FIG. 22).
Regarding claim 3, Soyano shows a structure, further comprising: a first metallic layer (element between radiation block 6 and chip 3 in FIG. 9a) disposed between the thermal interface material (radiation block 6) and the device (chip 3); and a second metallic layer (metallic substrate 71 as shown in FIG. 22) disposed between the thermal interface material (radiation block 6) and the lid (case 72).
Regarding claim 4, Soyano shows a structure, comprising, wherein the lid comprises an inlet (terminal 83/85 as shown in FIG. 25), an outlet and flow channels (terminal 83/85), the flow channels are in communication with the inlet and the outlet (see FIG. 25).
Regarding claim 5, Soyano shows a structure, comprising, wherein the device further comprises a semiconductor die (chip 3) laterally encapsulated by an inner insulating encapsulation (sealing 9) and an interposer (element 2bb), and the semiconductor die (chip 3) is disposed on and electrically connected to the interposer (element 2bb).
Allowable Subject Matter
Claims 10-20 are allowed. Regarding claim 10, Soyano fails to teach a reinforcement structure embedded in the insulating encapsulation wherein the heat sink is fastened to the reinforcement structure through screws. Regarding claim 18, Soyano also fails to teach a thermal interface material disposed between the semiconductor die and the lid, wherein a minimum distance between the lid and the first substrate substantially equals a sum of a maximum thickness of the outer insulating encapsulation and a thickness of the thermal interface material.
Claims 6-9 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ELIAS M ULLAH whose telephone number is (571)272-1415. The examiner can normally be reached M-F at 8AM-5PM EST.
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/ELIAS ULLAH/Primary Examiner, Art Unit 2893
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