Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
DETAILED ACTION
This action is responsive to the CON application No. 18/780,096 filed on July 22, 2024.
Priority
3. Receipt is acknowledged of papers submitted under 35 U.S.C. 119(a)-(d), which papers have been placed of record in the file.
Information Disclosure Statement
4. Acknowledgement is made of Applicant’s Information Disclosure Statement (IDS) form PTO-1449. These IDS has been considered.
Specification
5. The title of the invention is not descriptive. A new title is required that is clearly indicative of the invention to which the claims are directed.
The following title is suggested: “Electronic Package Comprising Electronic Component with Electrode Pad and Wire Surrounded Through Encapsulant Material a.
Double Patenting
6. The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/process/file/efs/guidance/eTD-info-I.jsp.
7. Claims 1-14 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-14 of U.S. Patent No. 12,100,633 B2. Although the claims at issue are not identical, they are not patentably distinct from each other because each of the instant limitations are recited in or obvious from claims 1-14 of U.S. Patent No. 12,100,633 B2.
Regarding independent claim 1, Lin et al. recites an electronic package, comprising:
an encapsulant (claim 1, line 2);
a first electronic component embedded in the encapsulant, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one wire is provided inside the first electronic component and is free from being exposed from the active surface (claim 1, lines 3-9); and
at least one conductive layer contacted with the non-active surface of the first electronic component and electrically connected with the at least one wire (claims 1-2, line 12-13, lines 1-3, respectively).
Regarding claim 2, Lin et al. recites wherein, the at least one conductive layer is further formed on the side surfaces of the first electronic component, and the at least one wire is exposed from the side surfaces of the first electronic component for contacting the at least one conductive layer (claim 2, lines 1-6).
Regarding claim 3, Lin et al. recites wherein, the at least one wire is exposed from the non-active surface of the first electronic component for contacting the at least one conductive layer (claim 2, lines 3-6).
Regarding claim 4, Lin et al. recites wherein, at least one electrode pad is disposed on the active surface and electrically connected with the at least one wire (claim 4, lines 1-3).
Regarding claim 5, Lin et al. recites wherein, the at least one electrode pad is positioned in a center of the active surface (claim 5, lines 1-3).
Regarding claim 6, Lin et al. recites wherein, the at least one conductive layer is free from being formed on the at least one electrode pad (claim 6, lines 1-3).
Regarding claim 7, Lin et al. recites wherein, further comprising a routing structure formed on the encapsulant and electrically connected with the at least one electrode pad (claim 7, lines 1-3).
Regarding claim 8, Lin et al. recites wherein, the routing structure includes a first surface and a second surface opposite to the first surface, wherein the encapsulant and the first electronic component are disposed on the first surface, and at least one second electronic component electrically connected with the routing structure is disposed on the second surface, and wherein a plurality of second electronic components are disposed on the second surface of the routing structure, such that the first electronic component is electrically bridged between two of the plurality of second electronic components (claim 8, lines 1-11).
Regarding claim 9, Lin et al. recites wherein, further comprising conductive pillars embedded in the encapsulant (claim 9, lines 1-2).
Regarding claim 10, Lin et al. recites wherein, further comprising a plurality of conductive components formed on the encapsulant and electrically connected with the at least one conductive layer and the conductive pillars (claim 10, lines 1-4).
Regarding claim 11, Lin et al. recites wherein, further comprising a plurality of conductive components formed on the encapsulant and electrically connected with the at least one conductive layer (claim 11, lines 1-4).
Regarding claim 12, Lin et al. recites wherein, a plurality of the wires separated and disconnected from one another are provided inside the first electronic component, and a plurality of the conductive layers separated and disconnected from one another are formed on the first electronic component, such that each of the plurality of wires is electrically connected to a different conductive layer (claim 12, lines 1-7).
Regarding claim 13, Lin et al. recites wherein, each of the plurality of conductive layers is formed on the non-active surface and one of the side surfaces of the first electronic component, and each of the plurality of wires is exposed respectively from one of the side surfaces of the first electronic component for contacting the plurality of conductive layers (claim 13, lines 1-7).
Regarding claim 14, Lin et al. recites wherein, each of the plurality of conductive layers is formed on the non-active surface of the first electronic component, and each of the plurality of wires is exposed respectively from the non-active surface of the first electronic component for contacting the plurality of conductive layers (claim 14, lines 1-6).
8. Claims 1, 3-11 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-9 of U.S. Patent No. 11,728,234 B2. Although the claims at issue are not identical, they are not patentably distinct from each other because each of the instant limitations are recited in or obvious from claims 1-11 of U.S. Patent No. 11,728,234 B2.
Regarding independent claim 1, Lin et al. recites an electronic package, comprising:
an encapsulant (claim 1, line 2);
a first electronic component embedded in the encapsulant, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface (claim 1, lines 3-7), wherein at least one wire is provided inside the first electronic component (claim 1, lines 10-11) and is free from being exposed from the active surface; and at least one conductive layer contacted with the non-active surface of the first electronic component and electrically connected with the at least one wire (claim 1, lines 12-14).
Regarding claim 3, Lin et al. recites wherein, the at least one wire is exposed from the non-active surface of the first electronic component for contacting the at least one conductive layer (claim 3, lines 1-4).
Regarding claim 4, Lin et al. recites wherein, at least one electrode pad is disposed on the active surface and electrically connected with the at least one wire (claim 1, lines 7-10).
Regarding claim 5, Lin et al. recites wherein, the at least one electrode pad is positioned in a center of the active surface (claim 2, lines 1-3).
Regarding claim 6, Lin et al. recites wherein, the at least one conductive layer is free from being formed on the at least one electrode pad (claim 1, lines 14-16).
Regarding claim 7, Lin et al. recites wherein, further comprising a routing structure formed on the encapsulant and electrically connected with the at least one electrode pad (claim 5, lines 1-3).
Regarding claim 8, Lin et al. recites wherein, the routing structure includes a first surface and a second surface opposite to the first surface, wherein the encapsulant and the first electronic component are disposed on the first surface, and at least one second electronic component electrically connected with the routing structure is disposed on the second surface, and wherein a plurality of second electronic components are disposed on the second surface of the routing structure, such that the first electronic component is electrically bridged between two of the plurality of second electronic components (claim 6, lines 1-11).
Regarding claim 9, Lin et al. recites wherein, further comprising conductive pillars embedded in the encapsulant (claim 7, lines 1-2).
Regarding claim 10, Lin et al. recites wherein, further comprising a plurality of conductive components formed on the encapsulant and electrically connected with the at least one conductive layer and the conductive pillars (claim 8, lines 1-4).
Regarding claim 11, Lin et al. recites wherein, further comprising a plurality of conductive components formed on the encapsulant and electrically connected with the at least one conductive layer (claim 9, lines 1-4).
Conclusion
9. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DIDARUL MAZUMDER whose telephone number is (571)272-8823. The examiner can normally be reached M-F 9-5.
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10. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, William Partridge can be reached at 571-270-1402. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/DIDARUL A MAZUMDER/Primary Examiner, Art Unit 2812
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