Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2800 2812 2818 2819 4100
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18752055 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18747852 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18478318 | MAGNETIC MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18721729 | PHOTODETECTION DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18701818 | LIGHT-EMITTING BASEPLATE AND PREPARATION METHOD THEREOF, AND LIGHT-EMITTING DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18521814 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18777454 | SUB-PIXEL, DISPLAY PANEL INCLUDING THE SAME, AND METHOD OF FABRICATING THE DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 18602289 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18423515 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18342744 | ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 17477850 | THIN-FILM TRANSISTORS WITH SHARED CONTACTS | Final Rejection | Intel Corporation |
| 18769417 | SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18767970 | METHOD OF FABRICATING PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18619755 | METALLIZATION AND PLANARIZATION | Non-Final OA | Tokyo Electron Limited |
| 18541732 | Carrier Confinement Structure of AlInGaP MicroLEDs | Non-Final OA | Lumileds LLC |
| 18438499 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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