Tech Center 2800 • Art Units: 2812 2818 2819
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18493267 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18478318 | MAGNETIC MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18241589 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE ARRAY INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18459821 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18574953 | Light-Emitting Substrate and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18380923 | LIGHT EMITTING DEVICE | Non-Final OA | TOYODA GOSEI CO., LTD. |
| 18005010 | SEMICONDUCTOR DEVICE WITH CONDUCTION PORTION AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18143056 | Shielding circuits and semiconductor devices | Final Rejection | Realtek Semiconductor Corp. |
| 18153470 | COAXIAL I/O DIE | Non-Final OA | BAE Systems Information and Electronic Systems Integration Inc. |
| 18104789 | SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18474872 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF AND MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18470559 | METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGRATED PASSIVE DEVICES | Non-Final OA | ATI Technologies ULC |
| 18451269 | STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18341897 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18475182 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Oregon State University |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | Non-Final OA | Wolfspeed, Inc. |
| 18462204 | Semiconductor Device and Method of Forming AIP Structure to Reduce Signal Interference Among and Between Encapsulant Blocks | Final Rejection | JCET STATS ChipPAC Korea Limited |
| 18466744 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE | Non-Final OA | SERIPHY TECHNOLOGY CORPORATION |
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