Prosecution Insights
Last updated: October 01, 2026
Application No. 18/781,435

EUV LITHOGRAPHY APPARATUS

Non-Final OA §DP
Filed
Jul 23, 2024
Priority
Aug 27, 2021 — continuation of 11/605,477 +1 more
Examiner
CHANG, HANWAY
Art Unit
Tech Center
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
1 (Non-Final)
86%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 86% — above average
86%
Career Allowance Rate
583 granted / 677 resolved
+26.1% vs TC avg
Moderate +8% lift
Without
With
+7.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 2m
Avg Prosecution
13 currently pending
Career history
695
Total Applications
across all art units

Statute-Specific Performance

§101
2.1%
-37.9% vs TC avg
§103
41.9%
+1.9% vs TC avg
§102
33.1%
-6.9% vs TC avg
§112
5.8%
-34.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 677 resolved cases

Office Action

§DP
DETAILED ACTION Double Patenting The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b). The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13. The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer. Claims 1-8 and 18-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-3, 6-7, and 20 of U.S. Patent No. 11,605,477, provided in information disclosure statement filed 7/23/2024, hereinafter ‘477. Although the claims at issue are not identical, they are not patentably distinct from each other because they claim the same or identical invention with the same limitations as shown in the table below. Clams of the Instant application Claims of ‘477 1. An EUV light source apparatus, comprising: an excitation laser inlet port configured to receive an excitation laser; and a first mirror configured to reflect the excitation laser that passes through a zone of excitation, wherein a metal droplet is irradiated by the excitation laser. 1. A method of operating an extreme ultra violet (EUV) light source apparatus, the EUV light source comprising, a metal droplet generator, a collector mirror, an excitation laser inlet port for receiving an excitation laser, a first mirror and a second mirror, the method comprising: introducing the excitation laser from the inlet port; reflecting the excitation laser that passes through a zone of excitation by the first mirror; and further reflecting the excitation laser reflected by the first mirror by the second mirror. 2. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward the zone of excitation. 3. The EUV light source apparatus of claim 2, wherein the second mirror is configured to focus the excitation laser reflected by the first mirror at the zone of excitation. 2. The method of claim 1, comprising directing the excitation laser reflected by the second mirror to pass through the zone of excitation. 4. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a collector mirror of the EUV light source apparatus. 7. The method of claim 5, comprising directing the excitation laser reflected by the second mirror to hit the collector mirror. 5. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a metal droplet catcher. 3. The method of claim 2, comprising directing the excitation laser reflected by the second mirror to hit a metal droplet catcher. 6. The EUV light source apparatus of claim 5, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the metal droplet catcher after passing through the zone of excitation. 2. The method of claim 1, comprising directing the excitation laser reflected by the second mirror to pass through the zone of excitation. 3. The method of claim 2, comprising directing the excitation laser reflected by the second mirror to hit a metal droplet catcher. 7. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a debris collection mechanism. 6. The method of claim 5, comprising directing the excitation laser reflected by the second mirror to hit a part of a debris collection mechanism. 8. The EUV light source apparatus of claim 7, wherein at least one of the first mirror or the second mirror is a flat mirror. 20. The EUV light source apparatus of claim 13, wherein at least one of the first mirror or the second mirror is a flat mirror. 17. A method of operating an EUV light source apparatus, the EUV light source comprising an excitation laser inlet port for receiving an excitation laser and a first mirror, and the method comprising: introducing the excitation laser from the excitation laser inlet port; and reflecting the excitation laser that passes through a zone of excitation by the first mirror toward a target location inside the EUV light source apparatus. 18. The method of claim 17, wherein the target location is a second mirror, and the method further comprises reflecting the excitation laser reflected by the first mirror by the second mirror. 1. A method of operating an extreme ultra violet (EUV) light source apparatus, the EUV light source comprising, a metal droplet generator, a collector mirror, an excitation laser inlet port for receiving an excitation laser, a first mirror and a second mirror, the method comprising: introducing the excitation laser from the inlet port; reflecting the excitation laser that passes through a zone of excitation by the first mirror; and further reflecting the excitation laser reflected by the first mirror by the second mirror. 19. The method of claim 18, further comprising directing the excitation laser reflected by the second mirror to pass through the zone of excitation. 2. The method of claim 1, comprising directing the excitation laser reflected by the second mirror to pass through the zone of excitation. 20. The method of claim 19, further comprising directing the excitation laser reflected by the second mirror to hit a metal droplet catcher. 3. The method of claim 2, comprising directing the excitation laser reflected by the second mirror to hit a metal droplet catcher. As seen from the mapping above, claims 1-3, 6-7, and 20 of ‘477 includes all the limitations of claims 1-8 and 18-20 of the instant application while also reciting further limitations. As such, the recited claims are not patentably distinct from each other. The various dependent claims are merely obvious variants. Claims 1-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-16 of U.S. Patent No. 12,119,129, hereinafter ‘129. Although the claims at issue are not identical, they are not patentably distinct from each other because they claim the same or identical invention with the same limitations as shown in the table below. Claims of the instant application Claims of ‘129 1. An EUV light source apparatus, comprising: an excitation laser inlet port configured to receive an excitation laser; and a first mirror configured to reflect the excitation laser that passes through a zone of excitation, wherein a metal droplet is irradiated by the excitation laser. 2. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward the zone of excitation. 1. An extreme ultra violet (EUV) light source apparatus, comprising: a collector mirror; an excitation laser inlet port configured to receive an excitation laser; a first mirror configured to reflect the excitation laser that passes through a zone of excitation; and a second mirror configured to reflect the excitation laser reflected by the first mirror. 3. The EUV light source apparatus of claim 2, wherein the second mirror is configured to focus the excitation laser reflected by the first mirror at the zone of excitation. 3. The EUV light source apparatus of claim 2, wherein the second mirror is configured to focus the excitation laser reflected by the first mirror at the zone of excitation. 4. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a collection mirror of the EUV light source apparatus. 4. The EUV light source apparatus of claim 1, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the collector mirror. 5. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a metal droplet catcher. 5. The EUV light source apparatus of claim 1, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward a metal droplet catcher. 6. The EUV light source apparatus of claim 5, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the metal droplet catcher after passing through the zone of excitation. 6. The EUV light source apparatus of claim 5, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the metal droplet catcher after passing through the zone of excitation. 7. The EUV light source apparatus of claim 1, further comprising a second mirror configured to reflect the excitation laser reflected by the first mirror toward a debris collection mechanism. 7. The EUV light source apparatus of claim 1, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward a debris collection mechanism. 8. The EUV light source apparatus of claim 1, wherein at least one of the first mirror or the second mirror is a flat mirror. 8. The EUV light source apparatus of claim 1, wherein at least one of the first mirror or the second mirror is a flat mirror. 9. An EUV light source apparatus, comprising: an excitation laser inlet port configured to receive an excitation laser; a first mirror configured to reflect the excitation laser that passes through a zone of excitation, wherein a metal droplet is irradiated by the excitation laser; a second mirror configured to reflect the excitation laser reflected by the first mirror; and a third mirror configured to reflect the excitation laser reflected by the second mirror. 9. An extreme ultra violet (EUV) light source apparatus, comprising: a collector mirror; an excitation laser inlet port configured to receive an excitation laser; a first mirror configured to reflect the excitation laser that passes through a zone of excitation; a second mirror configured to reflect the excitation laser reflected by the first mirror; and a third mirror configured to reflect the excitation laser reflected by the second mirror. 10. The EUV light source apparatus of claim 9, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the zone of excitation. 10. The EUV light source apparatus of claim 9, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the zone of excitation. 11. The EUV light source apparatus of claim 10, wherein the second mirror is configured to focus the excitation laser reflected by the first mirror at the zone of excitation. 11. The EUV light source apparatus of claim 10, wherein the second mirror is configured to focus the excitation laser reflected by the first mirror at the zone of excitation. 12. The EUV light source apparatus of claim 9, wherein the third mirror is configured to reflect the excitation laser reflected by the first mirror toward a debris collection mechanism. 12. The EUV light source apparatus of claim 9, wherein the third mirror is configured to reflect the excitation laser reflected by the first mirror toward a debris collection mechanism. 13. The EUV light source apparatus of claim 9, further comprising a controller configured to control at least one of the first mirror or the second mirror. 13. The EUV light source apparatus of claim 9, further comprising a controller configured to control at least one of the first mirror or the second mirror. 14. The EUV light source apparatus of claim 13, further comprising a sensor configured to monitor or detect deposition of metal debris, wherein the controller is configured to control at least one of the first mirror or the second mirror based on a monitoring result of the sensor. 14. The EUV light source apparatus of claim 13, further comprising a sensor configured to monitor or detect deposition of metal debris, wherein the controller is configured to control at least one of the first mirror or the second mirror based on a monitoring result of the sensor. 15. The EUV light source apparatus of claim 14, wherein the sensor is a camera. 15. The EUV light source apparatus of claim 14, wherein the sensor is a camera. 16. The EUV light source apparatus of claim 14, wherein when the sensor detects an excessive debris deposition above a threshold, the controller is configured to control the at least one of the first mirror or the second mirror to direct the excitation laser reflected by the second mirror to the excessive debris deposition. 16. The EUV light source apparatus of claim 14, wherein when the sensor detects an excessive debris deposition above a threshold, the controller is configured to control the at least one of the first mirror or the second mirror to direct the excitation laser reflected by the second mirror to the excessive debris deposition. 17. A method of operating an EUV light source apparatus, the EUV light source comprising an excitation laser inlet port for receiving an excitation laser and a first mirror, and the method comprising: introducing the excitation laser from the excitation laser inlet port; and reflecting the excitation laser that passes through a zone of excitation by the first mirror toward a target location inside the EUV light source apparatus. 18. The method of claim 17, wherein the target location is a second mirror, and the method further comprises reflecting the excitation laser reflected by the first mirror by the second mirror. 1. An extreme ultra violet (EUV) light source apparatus, comprising: a collector mirror; an excitation laser inlet port configured to receive an excitation laser; a first mirror configured to reflect the excitation laser that passes through a zone of excitation; and a second mirror configured to reflect the excitation laser reflected by the first mirror. 19. The method of claim 18, further comprising directing the excitation laser reflected by the second mirror to pass through the zone of excitation. 2. The EUV light source apparatus of claim 1, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward the zone of excitation. 20. The method of claim 19, further comprising directing the excitation laser reflected by the second mirror to hit a metal droplet catcher. 5. The EUV light source apparatus of claim 1, wherein the second mirror is configured to reflect the excitation laser reflected by the first mirror toward a metal droplet catcher. As seen from the mapping above, claims 1-16 of ‘129 includes all the limitations of claims 1-20 of the instant application while also reciting further limitations. While the claims of ‘129 (specifically claims 1 and 9) do not explicitly state the metal droplet is irradiated by the excitation laser, ‘129 discloses the excitation laser interacts with the metal droplet passing through a zone of excitation to generate metal plasma and/or to locally heat the inside the LPP EUV light source apparatus (see col. 13, lines 6-15). In light of this teaching, it would have been obvious to the ordinary artisan before the effective filing date to have the excitation laser interact with the target material to generate EUV light for the purpose of improving operation efficiency of the excitation laser source as taught by the specification of ‘129. The various dependent claims are merely obvious variants. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to HANWAY CHANG whose telephone number is (571)270-5766. The examiner can normally be reached Monday - Friday 7:30 AM - 4:00 PM EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Georgia Epps can be reached at (571) 272-2328. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. Hanway Chang /HC/ Examiner, Art Unit 2878 /GEORGIA Y EPPS/ Supervisory Patent Examiner, Art Unit 2878
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Prosecution Timeline

Jul 23, 2024
Application Filed
Aug 31, 2026
Non-Final Rejection mailed — §DP (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
86%
Grant Probability
94%
With Interview (+7.7%)
2y 2m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 677 resolved cases by this examiner. Grant probability derived from career allowance rate.

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