DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Double Patenting
The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the claims at issue are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); and In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on a nonstatutory double patenting ground provided the reference application or patent either is shown to be commonly owned with this application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
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Claim(s) 1-10, 16-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claim(s) 11, 13, 16, 19 of U.S. Patent No. 11764118, in view of Bolognia(USPGPUB DOCUMENT: 2017/0263515, hereinafter Bolognia).
Regarding Claim 1, Claim(S) 11, 13 of US Patent No. 11764118 teaches a package structure, comprising: a substrate; a chip structure over the substrate; a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element and the second adhesive element are made of different materials, the first adhesive element is in physical contact with the second adhesive element, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and the first adhesive element is closer to a side edge of the substrate than the second adhesive element; and a ground structure electrically connected to the protective lid through the first adhesive element; wherein the ground structure is surrounded by the substrate.
US Patent No. 11764118 does not teach a package structure, comprising: a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.
Bolognia discloses in Fig 1A/B a portion of the second adhesive element(32) is between the first adhesive element(34) and the chip-containing structure(52).
It would have been obvious to one of ordinary skill in the art before the effective filling date of the invention to apply the teachings of Bolognia to the teachings of US Patent No. 11764118 in order improve seals for cavity packages [0005, Bolognia].
Re Claim 2 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 1, wherein the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element.
Re Claim 3 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 1, wherein the first adhesive element has a first electrical resistivity, the second adhesive element has a second electrical resistivity, and the second electrical resistivity is greater than the first electrical resistivity.
Re Claim 4 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 1, wherein the ground structure penetrates through the substrate.
Re Claim 5 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 4, further comprising: a second ground structure, wherein the first adhesive element covers the ground structure and the second ground structure.
Re Claim 6 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 1, wherein the first adhesive element is in direct contact with the second adhesive element.
Re Claim 7 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 1, further comprising: a third adhesive element between the protective lid and the substrate, wherein the third adhesive element has a lower electrical resistivity than the second electrical resistivity of the second adhesive element.
Re Claim 8 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 7, wherein the third adhesive element is laterally surrounded by the second adhesive element.
Re Claim 9 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 7, further comprising: a second ground structure, wherein the third adhesive element covers the second ground structure.
Re Claim 10 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 7, wherein the third adhesive element is separated from the first adhesive element by the second adhesive element.
Regarding Claim 16, Claim(S) 16, 19 of US Patent No. 11764118 teaches a package structure, comprising: package structure, comprising: a substrate; a die package over the substrate; and a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the protective lid covers the die package, the first adhesive element has a first electrical resistivity, the second adhesive element has a second electrical resistivity, the second electrical resistivity is greater than the first electrical resistivity, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element; further comprising: a first ground via surrounded by the substrate, wherein the first adhesive element covers the first ground via; a second ground via surrounded by the substrate; and a third adhesive element between the protective lid and the substrate, wherein the third adhesive element covers the second ground via.
US Patent No. 11764118 does not teach a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.
Bolognia discloses in Fig 1A/B a portion of the second adhesive element(32), is between the first adhesive element(34) and the chip-containing structure(52).
It would have been obvious to one of ordinary skill in the art before the effective filling date of the invention to apply the teachings of Bolognia to the teachings of US Patent No. 11764118 in order improve seals for cavity packages [0005, Bolognia].
Re Claim 17 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 16, wherein the second adhesive element is closer to a corner edge of the substrate than the first adhesive element.
Re Claim 18 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 16, wherein the conductive structure is a ground structure.
Re Claim 19 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 16, wherein the second adhesive element laterally surrounds the first adhesive element.
Re Claim 20 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 16, further comprising: a third adhesive element between the protective lid and the substrate, wherein the third adhesive element is spaced apart from the first adhesive element, and the chip-containing structure is between the first adhesive element and the third adhesive element.
Claim(s) 11-15 are rejected on the ground of nonstatutory double patenting as being unpatentable over claim(s) 16,19 of U.S. Patent No. 11764118, in view of an alternative interpretation by Bolognia(USPGPUB DOCUMENT: 2017/0263515, hereinafter Bolognia).
Regarding Claim 11, Claim(S) 16, 19 of US Patent No. 11764118 teaches a package structure, comprising: package structure, comprising: a substrate; a die package over the substrate; and a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the protective lid covers the die package, the first adhesive element has a first electrical resistivity, the second adhesive element has a second electrical resistivity, the second electrical resistivity is greater than the first electrical resistivity, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element; further comprising: a first ground via surrounded by the substrate, wherein the first adhesive element covers the first ground via; a second ground via surrounded by the substrate; and a third adhesive element between the protective lid and the substrate, wherein the third adhesive element covers the second ground via.
US Patent No. 11764118 does not teach wherein the first adhesive element and the second adhesive element are made of different materials, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element,
Bolognia discloses in Fig 1A/B wherein the first adhesive element and the second adhesive element are made of different materials(32 can comprise an epoxy and 34 can comprise solder)[0029], the second adhesive element(34) is closer to a corner edge of the substrate than the first adhesive element(32),
It would have been obvious to one of ordinary skill in the art before the effective filling date of the invention to apply the teachings of Bolognia to the teachings of US Patent No. 11764118 in order improve seals for cavity packages [0005, Bolognia].
Re Claim 12 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 11, wherein a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.
Re Claim 13 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 11, wherein the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element.
Re Claim 14 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 13, wherein the ground structure is covered by the first adhesive element.
Re Claim 15 US Patent No. 11764118 and Bolognia teach the package structure as claimed in claim 11, wherein the first adhesive element is in direct contact with the second adhesive element.
Conclusion
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/PATRICIA D VALENZUELA/Primary Examiner, Art Unit 2812
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