Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2892
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18521629 | CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18454110 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18325708 | ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18255385 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18351284 | RADIO FREQUENCY DEVICES INCLUDING RADIO FREQUENCY ABSORBENT FEATURES | Non-Final OA | Infineon Technologies AG |
| 17954215 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18449941 | METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18438450 | INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY | Non-Final OA | Intel Corporation |
| 17895102 | ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING THEREOF | Non-Final OA | Intel Corporation |
| 17855636 | VOLTAGE CONTRAST SCAN AREA ON A WAFER | Final Rejection | Intel Corporation |
| 18460959 | HEAT SPREADER AND ELECTRONIC COMPONENT DEVICE | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18549447 | DOUBLE-SIDE COOLED POWER MODULES | Non-Final OA | VIRGINIA TECH INTELLECTUAL PROPERTIES, INC. |
| 18207918 | SYSTEMS, APPARATUSES, AND METHODS FOR NANOWIRES FOR SEMICONDCUTOR PACKAGES | Non-Final OA | STMicroelectronics International N.V. |
| 18450358 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18360178 | SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17988285 | INTEGRATED RESISTOR | Non-Final OA | Microchip Technology Incorporated |
| 18352055 | DEVICE HAVING MULTIPHASE DIELECTRIC LAYER AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18348041 | INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE | Non-Final OA | Marvell Asia Pte Ltd |
| 18347594 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Industrial Technology Research Institute |
| 18350839 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18351524 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Infineon Technologies Austria AG |
| 18203763 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18336376 | Die-Attach Fillet Height Reduction | Non-Final OA | Wolfspeed, Inc. |
| 18484407 | SENSOR PACKAGE STRUCTURE | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18223539 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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