Tech Center 2800 • Art Units: 2812 2819 2892
This examiner grants 90% of resolved cases
Patricia D. Valenzuela is an examiner in Tech Center 2800 and Art Unit 2812, with 722 resolved cases. She maintains an allowance rate of 90.3%, which is a very high mark that suggests a streamlined path to patent issuance for most applicants. This 90.3% rate is a key indicator of the examiner's tendency to grant applications. The volume of 722 cases ensures that these statistics are representative of her overall performance.
The median days to allowance for this examiner is 808, reflecting a relatively efficient prosecution timeline. Additionally, the data shows an interview lift of 2.0%, which indicates a slight increase in the probability of success following an interview. Given the high base allowance rate, this modest lift suggests that written amendments and arguments are often sufficient to reach a grant. The 808-day median pendency is an attractive feature for applicants seeking a quick resolution in Art Unit 2812.
For practitioners, the strategy with this examiner should focus on high-quality written submissions, though interviews remain a viable option. The 2.0% lift suggests that the 722 resolved cases were largely decided on the merits of the written record. With a 90.3% allowance rate and an 808-day median, the examiner's docket is both highly favorable and efficient. This data-driven insight allows for a more focused allocation of resources during the prosecution phase in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18708412 | COMPOSITE OPTICAL FILM AND DISPLAY DEVICE COMPRISING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 18521629 | CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18454110 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18448746 | Vertical Transistor Cell Structures Utilizing Topside and Backside Resources | Non-Final OA | Apple Inc. |
| 18726415 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18764899 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18592088 | DISPLAY DEVICE AND A METHOD FOR MANUFACTURING A DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18439660 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18412347 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18430442 | SEMICONDUCTOR DEVICE WITH MONOCRYSTALLINE EXTRINSIC BASE | Non-Final OA | NXP B.V. |
| 18523541 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18438450 | INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY | Final Rejection | Intel Corporation |
| 17895102 | ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING THEREOF | Final Rejection | Intel Corporation |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | Non-Final OA | Intel Corporation |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | Final Rejection | Intel Corporation |
| 18764060 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18255385 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18736722 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18422166 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | MEDIATEK Inc. |
| 18377672 | DUAL SIDE STACKED TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 18449941 | METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18575060 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Hitachi, Ltd. |
| 18348041 | INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE | Final Rejection | Marvell Asia Pte Ltd |
| 18583026 | SEMICONDUCTOR DEVICE | Final Rejection | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18442748 | SEMICONDUCTOR LIGHT-RECEIVING DEVICE | Non-Final OA | Sumitomo Electric Industries, Ltd. |
| 18325708 | ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17977810 | OPTICAL SENSOR WITH TSV STRUCTURE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18346674 | SEMICONDUCTOR DIE STACK STRUCTURE | Non-Final OA | SK hynix Inc. |
| 18443362 | Common source transistor apparatus | Final Rejection | REALTEK SEMICONDUCTOR CORPORATION |
| 18233092 | POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS | Non-Final OA | STMicroelectronics, Inc. |
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