Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2892
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18708412 | COMPOSITE OPTICAL FILM AND DISPLAY DEVICE COMPRISING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 18611841 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18463550 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18707083 | ORGANIC SEMICONDUCTOR FILM, PHOTOELECTRIC CONVERSION ELEMENT, AND IMAGING DEVICE | Non-Final OA | SONY GROUP CORPORATION |
| 18332777 | MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18764899 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18592088 | DISPLAY DEVICE AND A METHOD FOR MANUFACTURING A DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18420231 | INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTEGRATED CIRCUIT (PMIC) | Non-Final OA | QUALCOMM Incorporated |
| 17895102 | ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING THEREOF | Final Rejection | Intel Corporation |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | Non-Final OA | Intel Corporation |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | Final Rejection | Intel Corporation |
| 17855636 | VOLTAGE CONTRAST SCAN AREA ON A WAFER | Non-Final OA | Intel Corporation |
| 17837732 | TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS | Non-Final OA | Intel Corporation |
| 18575060 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Hitachi, Ltd. |
| 18764060 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18323600 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18736722 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18346674 | SEMICONDUCTOR DIE STACK STRUCTURE | Non-Final OA | SK hynix Inc. |
| 18325708 | ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17977810 | OPTICAL SENSOR WITH TSV STRUCTURE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18075502 | INTEGRATED CIRCUIT LAYOUT AND INTEGRATED CIRCUIT LAYOUT METHOD FOR FILTER | Non-Final OA | REALTEK SEMICONDUCTOR CORP. |
| 18046111 | BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACITANCE AND RELATED APPARATUSES, COMPUTING SYSTEMS, AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18628296 | ANTI-REFLECTIVE NANOSTRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Korea Advanced Institute of Science And Technology |
| 18780029 | REDUCING RC DELAY IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18771450 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18365252 | SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
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