Prosecution Insights
Last updated: October 01, 2026
Application No. 18/791,308

MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE

Non-Final OA §112
Filed
Jul 31, 2024
Priority
Apr 15, 2021 — divisional of 11/854,940 +1 more
Examiner
RAMALLO, GUSTAVO G
Art Unit
Tech Center
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
1 (Non-Final)
95%
Grant Probability
Favorable
1-2
OA Rounds
1m
Est. Remaining
98%
With Interview

Examiner Intelligence

Grants 95% — above average
95%
Career Allowance Rate
556 granted / 584 resolved
+35.2% vs TC avg
Minimal +2% lift
Without
With
+2.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
41 currently pending
Career history
592
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
53.0%
+13.0% vs TC avg
§102
28.7%
-11.3% vs TC avg
§112
15.4%
-24.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 584 resolved cases

Office Action

§112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Information Disclosure Statement The information disclosure statement (IDS) submitted on July 31, 2024, March 5, 2025 is being considered by the examiner. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1-5, 13-15 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 1 recites the limitation "the exposed end surface" in line 10. There is insufficient antecedent basis for this limitation in the claim. For purposes of examination this will be interpreted as “the end surface” Claim 2 recites the limitation "the sidewall" in line 2. There is insufficient antecedent basis for this limitation in the claim. For purposes of examination this will be interpreted as “the first sidewall” Claim 3 recites the limitation "the sidewall" in line 4. There is insufficient antecedent basis for this limitation in the claim. For purposes of examination this will be interpreted as “the first sidewall” Note: Claims 2-5 inherit the deficiencies of claim 1. Claim 13 recites the limitation "the transistor" in line 1. There is insufficient antecedent basis for this limitation in the claim. For purposes of examination this will be interpreted as “the first transistor” Note: Claims 14-15 inherit the deficiencies of claim 13. Claim 16, lines: 13-14 recite the limitation “electrically connecting the first transistor to a first interconnect structure on the first side of the substrate.” It is unclear what is electrically connecting the first transistor to a first interconnect structure. For purposes of examination this will be interpreted as “electrically connecting the first transistor to a first interconnect structure on the first side of the substrate through the SIS.” Note: Claims 17-20 inherit the deficiencies of claim 16. Allowable Subject Matter Claims 1-5, 16-20 would be allowed if rewritten to overcome the 112 rejection above The following is a statement of reasons for the indication of allowable subject matter: the closest prior art of record, Greene (US 2017/0062325), Purushothaman (US 2015/0054149), fail to disclose (by themselves or in combination) the following limitations in combination with the rest of the claim: Regarding Claim 1 (from which claims 2-5 depend), a self-aligned interconnect structure (SIS) extending through an entirety of the substrate in a thickness direction, wherein the spacer material separates a portion of the SIS from the first transistor and from the second transistor, and an end surface of the SIS on the second side of the substrate is coplanar with the end surface of the second transistor. Regarding Claim 16 (from which claims 17-20 depend), a self-aligned interconnect structure (SIS) extending through an entirety of the substrate in a thickness direction, wherein the spacer material separates a portion of the SIS from the first transistor and from the second transistor, and an end surface of the SIS on the second side of the substrate is coplanar with the end surface of the second transistor… Claims 6-12 are allowed. The following is a statement of reasons for the indication of allowable subject matter: the closest prior art of record, Greene (US 2017/0062325), Purushothaman (US 2015/0054149), fail to disclose (by themselves or in combination) the following limitations in combination with the rest of the claim: Regarding Claim 6 (from which claims 7-12 depend), a self-aligned interconnect structure (SIS) extending through an entirety of the substrate in a thickness direction, wherein the spacer material separates a portion of the SIS from the first transistor and from the second transistor, and an end surface of the SIS on the second side of the substrate is coplanar with the end surface of the second transistor. Note: if claims 13-15 would also be allowed if rewritten to overcome the 112 rejections above. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Greene (US 2017/0062325) discloses (Fig. 2G) a self-aligned interconnect patterning stack 244 on fin transistors 220s. Greene does not disclose a self-aligned interconnect structure (SIS) extending through an entirety of the substrate in a thickness direction, wherein the spacer material separates a portion of the SIS from the first transistor and from the second transistor, and an end surface of the SIS on the second side of the substrate is coplanar with the end surface of the second transistor. Purushothaman (US 2015/0054149) discloses (Figs. 8-9) first wafer 4000 and second wafer 7000 is formed on two sides of bonding pads 3200 and 6200 with interconnect structures 1900 and 5000 on either side of the pads. Purushothaman does not disclose a self-aligned interconnect structure (SIS) extending through an entirety of the substrate in a thickness direction, wherein the spacer material separates a portion of the SIS from the first transistor and from the second transistor, and an end surface of the SIS on the second side of the substrate is coplanar with the end surface of the second transistor. Any inquiry concerning this communication or earlier communications from the examiner should be directed to GUSTAVO G RAMALLO whose telephone number is (571)272-9227. The examiner can normally be reached Monday-Friday 10am - 6pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, William Partridge can be reached at (571) 270-1402. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /GUSTAVO G RAMALLO/Examiner, Art Unit 2812
Read full office action

Prosecution Timeline

Jul 31, 2024
Application Filed
Sep 22, 2026
Non-Final Rejection mailed — §112 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
95%
Grant Probability
98%
With Interview (+2.4%)
2y 3m (~1m remaining)
Median Time to Grant
Low
PTA Risk
Based on 584 resolved cases by this examiner. Grant probability derived from career allowance rate.

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