Prosecution Insights
Last updated: October 23, 2026
Application No. 18/791,906

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Non-Final OA §102§112
Filed
Aug 01, 2024
Priority
Apr 24, 2024 — TW 113115300
Examiner
LEE, EUGENE
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Siliconware Precision Industries Co., Ltd.
OA Round
1 (Non-Final)
82%
Grant Probability
Favorable
1-2
OA Rounds
5m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
761 granted / 928 resolved
+14.0% vs TC avg
Moderate +6% lift
Without
With
+5.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 8m
Avg Prosecution
37 currently pending
Career history
972
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
59.7%
+19.7% vs TC avg
§102
16.7%
-23.3% vs TC avg
§112
13.4%
-26.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 928 resolved cases

Office Action

§102 §112
DETAILED ACTION Election/Restrictions Applicant's election with traverse of Group I, Species I (claims 1-3, and 6-10) in the reply filed on 9/15/26 is acknowledged. The traversal is on the ground(s) that that search and examination of the entire application can be made without serious burden. This is found not persuasive since Species II and III require different search queries from Species I wherein the Species have features that are mutually exclusive to each other. However, applicant is reminded that any claims that are dependent on an allowed claim are subject to rejoinder. The requirement is still deemed proper and is therefore made FINAL. Claims 4, 5, and 11-20 are withdrawn from further consideration pursuant to 37 CFR 1.142(b), as being drawn to a nonelected invention, there being no allowable generic or linking claim. Applicant timely traversed the restriction (election) requirement in the reply filed on 9/15/26. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claim 6 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. In lines 1-2 of claim 6, the applicant states “a first insulating layer formed on the first encapsulation layer”; however, it appears (see, for example, FIG 2K) that the first insulating layer 211 is under the encapsulation layer 213. Appropriate clarification and/or correction are required. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. In view of the 112 rejection above, claim(s) 1 thru 3, and 6 thru 10 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ganesan et al. US 2022/0181262 A1. Ganesan discloses (see, for example, FIG. 4) an electronic package 400, comprising: a first electronic element 100; a plurality of conductive pillars (i.e. outside structures) 211 disposed around the first electronic element 100; at least a reinforcement member (i.e. interior structures) 211 disposed around the first electronic element 100; a first encapsulation layer 210 for encapsulating the first electronic element 100, the conductive pillar 211, and the reinforcement member 211; and a redistribution layer 617 formed on a first side (i.e. top side) of the first electronic element 100, the conductive pillars 211, the reinforcement member 211, and the first encapsulation layer 210, wherein the redistribution layer 617 is electrically connected to the first electronic element 100 and the conductive pillars 211. Regarding claim 2, see, for example, for example, paragraph [0030] wherein Ganesan discloses the reinforcement member being copper, etc. Regarding claim 3, see, for example, FIG. 4 wherein Ganesan discloses the reinforcement member (i.e. interior structures) 211 being disposed between the first electronic element 100 and the conductive pillars (i.e. outside structures) 211. Regarding claim 6, see, for example, FIG. 4 wherein Ganesan discloses a first insulating layer 327 formed on the first encapsulation layer 210, such that the first electronic element 100 is bonded to the first insulating layer 327 via an inactive surface of the first electronic element 100 by an adhesive layer 618. Regarding claim 7, see, for example, FIG. 4 wherein Ganesan discloses a second electronic element 114 disposed on a first side of the redistribution layer 617, and electrically connected to the redistribution layer 617. Regarding claim 8, see, for example, FIG. 4 wherein Ganesan discloses a second encapsulation layer 619 formed on the first side of the redistribution layer 617 and encapsulating the second electronic element 114. Regarding claim 9, see, for example, FIG. 4 wherein Ganesan discloses a carrier structure 302 having a first side (i.e. top side) and a second side (i.e. bottom side) opposite to the first side (i.e. top side) for the first electronic element 100, the conductive pillars 211, the reinforcement member 211 and the first encapsulation layer 210 to be disposed on the first side (i.e. top side) of the carrier structure 302, and electrically connected to the redistribution layer 617 through the conductive pillars 211. Regarding claim 10, see, for example, FIG. 4 wherein Ganesan discloses the second side (i.e. bottom side) of the carrier structure 302 being disposed with a plurality of conductors (i.e. unlabeled pads within the carrier structure 302). INFORMATION ON HOW TO CONTACT THE USPTO Any inquiry concerning this communication or earlier communications from the examiner should be directed to EUGENE LEE whose telephone number is (571)272-1733. The examiner can normally be reached M-F 730-330 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JOSHUA BENITEZ can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. Eugene Lee October 7, 2026 /EUGENE LEE/Primary Examiner, Art Unit 2815
Read full office action

Prosecution Timeline

Aug 01, 2024
Application Filed
Oct 15, 2026
Non-Final Rejection mailed — §102, §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
82%
Grant Probability
88%
With Interview (+5.7%)
2y 8m (~5m remaining)
Median Time to Grant
Low
PTA Risk
Based on 928 resolved cases by this examiner. Grant probability derived from career allowance rate.

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