Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-12 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 2 requires in part “wherein the temperature control value (Applicant’s C1; Figure 2; C3,”C13”; Figure 5) includes a prescribed first temperature control value (Applicant’s C11; Figure 2; C14; Figure 5) for directing a temperature lower than the second temperature (Applicant’s T12; Figure 2; Applicant’s T22; Figure 2)”. It is unclear what of the many temperatures claimed is “a temperature”. The below claim analysis assumes “for directing a temperature of the susceptor”. Claim 2 also recites numerous “current temperatures” with only one specific “current temperatures” being of the post-circulation temperature control fluid. The Examiner assumes for the analysis below, as guided by Applicant’s Figure 5, that the remaining four (4) “current temperatures” are “current temperatures” of either the post-circulation temperature control fluid or that of the susceptor within the context of the claims and interpretation with Figure 5.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-12 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Buchberger; Douglas A. et al. (US 20130240144 A1). Buchberger teaches a flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment to adjust a temperature of a susceptor (320; Figure 1-4) from a prescribed first temperature (approx. 63º; Figure 7-Applicant’s T11 setpoint; Figure 2; Applicant’s T21; Figure 5) to a prescribed second temperature (60º; Figure 7-Applicant’s T12; Figure 2; Applicant’s T22; Figure 2) by circulating a temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) through the susceptor (320; Figure 1-4) provided in a semiconductor manufacturing device (Figure 1), wherein the unit comprises: an output pipe (115; Figure 4-Applicant’s 4; Figure 1) to output the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) to{from} the susceptor (320; Figure 1-4); a first temperature measuring part (376A; Figure 4; [0046]-Applicant’s 64; Figure 1) to measure a temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1); an input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1) to input a post-circulation temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), which is a temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1) to the susceptor (320; Figure 1-4) and circulated through the susceptor (320; Figure 1-4); a control device (501,510,520,320; Figure 5; [0047]) to create a temperature control value (CNTRL OUT line; Figure 7; “Control Out” [0054]-Applicant’s C1; Figure 2; C3,”C13”; Figure 5) for directing the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1); a fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) to adjust the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1) based on the temperature control value (CNTRL OUT line; Figure 7; “Control Out” [0054]-Applicant’s C1; Figure 2; C3,”C13”; Figure 5); and a second temperature measuring part (230A,230N; [0041]; Figure 4-Applicant’s 61; Figure 1) to measure a current temperature of the post-circulation temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), wherein the temperature control value (CNTRL OUT line; Figure 7; “Control Out” [0054]-Applicant’s C1; Figure 2; C3,”C13”; Figure 5) includes a prescribed first temperature control value (CNTRL OUT at 0º; Figure 7-Applicant’s C11; Figure 2; C14; Figure 5) for directing a temperature {of the susceptor} lower than the second temperature (60º; Figure 7-Applicant’s T12; Figure 2; Applicant’s T22; Figure 2) and a prescribed second temperature control value (CNTRL OUT at approx 38ºC; Figure 7-Applicant’s C15; Figure 2) for directing the temperature equal to the second temperature (60º; Figure 7-Applicant’s T12; Figure 2; Applicant’s T22; Figure 2), the fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) is configured to: perform first adjusting (Figure 6) to adjust the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) by the first temperature control value (CNTRL OUT at 0º; Figure 7-Applicant’s C11; Figure 2; C14; Figure 5) until a current temperature {of the temperature control fluid} increases to a prescribed threshold value (40ºC; Figure 7-Applicant’s T13 or “third temperature”; Figure 2; T23; Figure 5; [0091]), which is lower than the second temperature (60º; Figure 7-Applicant’s T12; Figure 2; Applicant’s T22; Figure 2), when the current temperature {of the susceptor} is lower than the second temperature (60º; Figure 7-Applicant’s T12; Figure 2; Applicant’s T22; Figure 2); and perform second adjusting (Figure 6) to adjust the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) by the second temperature control value (CNTRL OUT at approx 38ºC; Figure 7-Applicant’s C15; Figure 2) when the current temperature {of the susceptor} increases to the threshold value (40ºC; Figure 7-Applicant’s T13 or “third temperature”; Figure 2; T23; Figure 5; [0091]) the temperature control value (CNTRL OUT line; Figure 7; “Control Out” [0054]-Applicant’s C1; Figure 2; C3,”C13”; Figure 5) in the second adjusting (Figure 6) has a gradual change from the first temperature control value (CNTRL OUT at 0ºC; Figure 7-Applicant’s C11 trace; Figure 2; C14; Figure 5) to the second temperature control value (CNTRL OUT at approx 38ºC; Figure 7-Applicant’s C15; Figure 2), and the gradual change is set at an inclination that keeps the current temperature {of the susceptor} from exceeding the threshold value (40ºC; Figure 7-Applicant’s T13 or “third temperature”; Figure 2; T23; Figure 5; [0091]), as claimed by claim 1
Buchberger further teaches:
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim l, wherein the fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) includes a low-temperature pipe (112; Figure 4) through which a low-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) for lowering the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) flows, a high-temperature pipe (114; Figure 4) through which a high-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) for increasing the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) flows, and a spool valve (120A; Figure 4-Applicant’s 21; Figure 1; [0046]) connected to the output pipe (115; Figure 4-Applicant’s 4; Figure 1), the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1), the low-temperature pipe (112; Figure 4), and the high-temperature pipe (114; Figure 4), and the fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) is configured to control a flow rate distribution ratio (operation 625; Figure 6; [0053]) of the post-circulation temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), the low-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), and the high-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) to adjust the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1), as claimed by claim 5
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 1, wherein the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1) includes a pump (240; Figure 4-Applicant’s 14; Figure 1; [0040]) to circulate the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), and the second temperature measuring part (230A,230N; [0041]; Figure 4-Applicant’s 61; Figure 1) is provided on an upstream side of the pump (240; Figure 4-Applicant’s 14; Figure 1; [0040]), as claimed by claim 6
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 1,wherein the flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment further comprises a joint pipe (piping between ESC Zone and 120A,120N; Figure 4-Applicant’s 1005; Figure 1) joining the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1) and the susceptor (320; Figure 1-4), and the second temperature measuring part (230A,230N; [0041]; Figure 4-Applicant’s 61; Figure 1) is provided in the joint pipe (piping between ESC Zone and 120A,120N; Figure 4-Applicant’s 1005; Figure 1), as claimed by claim 7
A semiconductor manufacturing device (Figure 1) provided with the susceptor (320; Figure 1-4) and the flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 1,which is connected to the susceptor (320; Figure 1-4), as claimed by claim 8
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 2, wherein the fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) includes a low-temperature pipe (112; Figure 4) through which a low-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) for lowering the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) flows, a high-temperature pipe (114; Figure 4) through which a high-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) for increasing the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) flows, and a spool valve (120A; Figure 4-Applicant’s 21; Figure 1; [0046]) connected to the output pipe (115; Figure 4-Applicant’s 4; Figure 1), the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1), the low-temperature pipe (112; Figure 4), and the high-temperature pipe (114; Figure 4), and the fluid control part (530; Figure 5-Applicant’s 24; Figure 1; [0040]) is configured to control a flow rate distribution ratio (operation 625; Figure 6; [0053]) of the post-circulation temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), the low-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), and the high-temperature fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) to adjust the temperature (CNTRL Out line; Figure 7) of the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]) output from the output pipe (115; Figure 4-Applicant’s 4; Figure 1), as claimed by claim 9
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 2, wherein the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1) includes a pump (240; Figure 4-Applicant’s 14; Figure 1; [0040]) to circulate the temperature control fluid (“heat transfer fluid...Galden HT135, HT200, etc. ”; [0037]), and the second temperature measuring part (230A,230N; [0041]; Figure 4-Applicant’s 61; Figure 1) is provided on an upstream side of the pump (240; Figure 4-Applicant’s 14; Figure 1; [0040]), as claimed by claim 10
The flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 2, wherein the flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment further comprises a joint pipe (piping between ESC Zone and 120A,120N; Figure 4-Applicant’s 1005; Figure 1) joining the input pipe (216 or 217; Figure 2-4; [0037]-Applicant’s 3; Figure 1) and the susceptor (320; Figure 1-4), and the second temperature measuring part (230A,230N; [0041]; Figure 4-Applicant’s 61; Figure 1) is provided in the joint pipe (piping between ESC Zone and 120A,120N; Figure 4-Applicant’s 1005; Figure 1), as claimed by claim 11
A semiconductor manufacturing device (Figure 1) provided with the susceptor (320; Figure 1-4) and the flowrate control unit (370,375; Figure 1; [0031]; 501; Figure 5,8-Applicant’s 1; Figure 1; [0099]) for temperature adjustment according to claim 2, which is connected to the susceptor (320; Figure 1-4), as claimed by claim 12
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Wafer temperature control apparatus include US 20200173014 A1; US 20120161405 A1; US 20180053669 A1; US 20170278731 A1; US 20110287560 A1; US 20170269616 A1
Any inquiry concerning this communication or earlier communications from the examiner should be directed to Examiner Rudy Zervigon whose telephone number is (571) 272- 1442. The examiner can normally be reached on a Monday through Thursday schedule from 8am through 6pm EST. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Any Inquiry of a general nature or relating to the status of this application or proceeding should be directed to the Chemical and Materials Engineering art unit receptionist at (571) 272-1700. If the examiner cannot be reached please contact the examiner's supervisor, Parviz Hassanzadeh, at (571) 272- 1435.
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/Rudy Zervigon/ Primary Examiner, Art Unit 1716
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