Tech Center 2800 • Art Units: 1715 1716 1792 2812
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479233 | ATOMIC LAYER DEPOSITION APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17987374 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18510336 | COLD PLATE FOR TRAPPING ETCHING AND DEPOSITION BYPRODUCTS | Non-Final OA | Applied Materials, Inc. |
| 18558817 | NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL | Non-Final OA | Applied Materials, Inc. |
| 18382114 | CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPITAXIAL DEPOSITION OPERATIONS | Non-Final OA | Applied Materials, Inc. |
| 18209716 | SEMICONDUCTOR MANUFACTURING PROCESS CHAMBER COOLING FLANGE FOR REMOTE PLASMA SOURCE SUPPLY | Non-Final OA | Applied Materials, Inc. |
| 18065742 | Gas Distribution Apparatuses | Final Rejection | Applied Materials, Inc. |
| 18070010 | GAS RECYCLING SYSTEMS, SUBSTRATE PROCESSING SYSTEMS, AND RELATED APPARATUS AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Final Rejection | Applied Materials, Inc. |
| 17663695 | HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR FILM PROCESSING | Final Rejection | Applied Materials, Inc. |
| 17672520 | ELECTROSTATIC CHUCK WITH METAL SHAFT | Non-Final OA | Applied Materials, Inc. |
| 18350519 | PLASMA PROCESSING METHOD AND APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18159865 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR PROCESSING SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18014884 | FILM FORMING APPARATUS AND FILM FORMING METHOD | Final Rejection | Tokyo Electron Limited |
| 17990022 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | TOKYO ELECTRON LIMITED |
| 17818547 | FILM FORMING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17650133 | SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD, AND METHOD OF MANUFACTURING SUBSTRATE HEATER | Non-Final OA | Tokyo Electron Limited |
| 18720333 | THERMOCHEMICAL TREATMENT FACILITY AND PROCESS FOR MANUFACTURING A COMPOSITE FRICTION COMPONENT | Final Rejection | SAFRAN CERAMICS |
| 17641233 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | Final Rejection | Hitachi High-Tech Corporation |
| 18386481 | CHAMBER LINER FOR SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18088255 | GAS SUPPLY UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING GAS SUPPLY UNIT | Non-Final OA | ASM IP Holding B.V. |
| 18072773 | REACTANT VAPOR DELIVERY SYSTEMS FOR SEMICONDUCTOR PROCESSING TOOLS AND METHODS | Final Rejection | ASM IP Holding B.V. |
| 17934956 | GAS INJECTOR FOR A VERTICAL FURNACE | Non-Final OA | ASM IP Holding B.V. |
| 17946304 | GAS-PHASE REACTOR SYSTEM AND METHOD OF CLEANING SAME | Final Rejection | ASM IP Holding B.V. |
| 18184736 | GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kokusai Electric Corporation |
| 18183090 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 17591396 | Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device | Final Rejection | Kokusai Electric Corporation |
| 17560684 | SUBSTRATE PROCESSING APPARATUS, PLASMA GENERATING DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING METHOD | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 18390078 | APPARATUS FOR TREATING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 17795188 | SEGMENTED GAS DISTRIBUTION PLATE FOR HIGH-POWER, HIGH-PRESSURE PROCESSES | Non-Final OA | LAM RESEARCH CORPORATION |
| 18299130 | WAFER PLACEMENT TABLE | Non-Final OA | NGK INSULATORS, LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy