Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1715 1716 1792 2812
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479233 | ATOMIC LAYER DEPOSITION APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18327211 | PLASMA POST-PROCESSING APPARATUS AND PLASMA POST-PROCESSING METHOD USING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17987374 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17934956 | GAS INJECTOR FOR A VERTICAL FURNACE | Non-Final OA | ASM IP Holding B.V. |
| 18589251 | LINERS HAVING FLOW OPENINGS, AND RELATED CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18558817 | NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL | Non-Final OA | Applied Materials, Inc. |
| 18382114 | CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPITAXIAL DEPOSITION OPERATIONS | Non-Final OA | Applied Materials, Inc. |
| 18209716 | SEMICONDUCTOR MANUFACTURING PROCESS CHAMBER COOLING FLANGE FOR REMOTE PLASMA SOURCE SUPPLY | Non-Final OA | Applied Materials, Inc. |
| 18065742 | Gas Distribution Apparatuses | Final Rejection | Applied Materials, Inc. |
| 18070010 | GAS RECYCLING SYSTEMS, SUBSTRATE PROCESSING SYSTEMS, AND RELATED APPARATUS AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Final Rejection | Applied Materials, Inc. |
| 17663695 | HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR FILM PROCESSING | Final Rejection | Applied Materials, Inc. |
| 17672520 | ELECTROSTATIC CHUCK WITH METAL SHAFT | Non-Final OA | Applied Materials, Inc. |
| 18720333 | THERMOCHEMICAL TREATMENT FACILITY AND PROCESS FOR MANUFACTURING A COMPOSITE FRICTION COMPONENT | Final Rejection | SAFRAN CERAMICS |
| 18350519 | PLASMA PROCESSING METHOD AND APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 17650133 | SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD, AND METHOD OF MANUFACTURING SUBSTRATE HEATER | Non-Final OA | Tokyo Electron Limited |
| 18183090 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 17591396 | Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device | Final Rejection | Kokusai Electric Corporation |
| 17560684 | SUBSTRATE PROCESSING APPARATUS, PLASMA GENERATING DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING METHOD | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 18119882 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Final Rejection | SEMES CO., LTD. |
| 18029963 | SHOWERHEAD WITH INTEGRAL DIVERT FLOW PATH | Non-Final OA | LAM RESEARCH CORPORATION |
| 17781447 | PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND DEPOSITION PROCESSES | Non-Final OA | LAM RESEARCH CORPORATION |
| 18573646 | APPARATUS FOR A THERMAL EVAPORATION SYSTEM AND METHOD OF COATING A COATING REGION ON A FRONT SURFACE OF A SUBSTRATE | Non-Final OA | MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V. |
| 18373279 | METAL PART AND PROCESS CHAMBER HAVING THE SAME | Non-Final OA | POINT ENGINEERING CO., LTD. |
| 18081263 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | WONIK IPS CO., LTD. |
| 16076057 | INDUCTIVELY HEATABLE SUSCEPTOR AND EPITAXIAL DEPOSITION REACTOR | Final Rejection | LPE S.p.A. |
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