Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1715 1716 1718 1792 2812 2881
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18720333 | THERMOCHEMICAL TREATMENT FACILITY AND PROCESS FOR MANUFACTURING A COMPOSITE FRICTION COMPONENT | Non-Final OA | SAFRAN CERAMICS |
| 18815363 | PLASMA PROCESSING DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18669753 | SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18327211 | PLASMA POST-PROCESSING APPARATUS AND PLASMA POST-PROCESSING METHOD USING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18761458 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18029963 | SHOWERHEAD WITH INTEGRAL DIVERT FLOW PATH | Non-Final OA | LAM RESEARCH CORPORATION |
| 17781447 | PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND DEPOSITION PROCESSES | Non-Final OA | LAM RESEARCH CORPORATION |
| 18773920 | SYSTEM AND METHOD FOR RECLAIMING TUNGSTEN COMPOUNDS | Non-Final OA | Micron Technology, Inc. |
| 18652612 | PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18589251 | LINERS HAVING FLOW OPENINGS, AND RELATED CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18558817 | NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL | Final Rejection | Applied Materials, Inc. |
| 18065742 | Gas Distribution Apparatuses | Non-Final OA | Applied Materials, Inc. |
| 18077087 | REDUCTION OF BR2 AND CL2 IN SEMICONDUCTOR PROCESSES | Final Rejection | Applied Materials, Inc. |
| 18856129 | FLOWRATE CONTROL UNIT FOR TEMPERATURE ADJUSTMENT AND SEMICONDUCTOR MANUFACTURING DEVICE | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18350519 | PLASMA PROCESSING METHOD AND APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18159865 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR PROCESSING SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18014884 | FILM FORMING APPARATUS AND FILM FORMING METHOD | Final Rejection | Tokyo Electron Limited |
| 17845354 | SHOWER HEAD AND PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 18430036 | COATING METHOD, PROCESSING APPARATUS, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM, SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kokusai Electric Corporation |
| 17964651 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18279027 | AUTOMATED THIN FILM DEPOSITION SYSTEM AND THIN FILM DEPOSITION METHOD TO WHICH MACHINE LEARNING IS APPLIED | Final Rejection | SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION |
| 18938859 | SHOWERHEAD UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18515867 | SUBSTRATE HEATER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18369967 | DELAYERING APPARATUS AND METHODS | Non-Final OA | FEI Company |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy