Tech Center 2800 • Art Units: 1713 1715 1716 1718 1792 2812 2881
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18815363 | PLASMA PROCESSING DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18761458 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18065889 | SUBSTRATE SUPPORT PLATE FOR DEPOSITING MATERIAL ON EDGES OF A SUBSTRATE FACE | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18386481 | CHAMBER LINER FOR SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18735190 | COATING APPARATUS | Non-Final OA | CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED |
| 18720333 | THERMOCHEMICAL TREATMENT FACILITY AND PROCESS FOR MANUFACTURING A COMPOSITE FRICTION COMPONENT | Non-Final OA | SAFRAN CERAMICS |
| 18652612 | PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18589251 | LINERS HAVING FLOW OPENINGS, AND RELATED CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18540680 | GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHODS AND APPARATUS, FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18558817 | NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL | Final Rejection | Applied Materials, Inc. |
| 18382114 | CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPITAXIAL DEPOSITION OPERATIONS | Final Rejection | Applied Materials, Inc. |
| 18375339 | METAL BONDED ESC WITH OUTER CERAMIC VACUUM ISOLATION RING FOR CRYOGENIC SERVICE | Non-Final OA | Applied Materials, Inc. |
| 18065742 | Gas Distribution Apparatuses | Non-Final OA | Applied Materials, Inc. |
| 18350519 | PLASMA PROCESSING METHOD AND APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17818547 | FILM FORMING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17845354 | SHOWER HEAD AND PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 17964651 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 17591396 | Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device | Final Rejection | Kokusai Electric Corporation |
| 18279027 | AUTOMATED THIN FILM DEPOSITION SYSTEM AND THIN FILM DEPOSITION METHOD TO WHICH MACHINE LEARNING IS APPLIED | Final Rejection | SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION |
| 18029963 | SHOWERHEAD WITH INTEGRAL DIVERT FLOW PATH | Non-Final OA | LAM RESEARCH CORPORATION |
| 17781447 | PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND DEPOSITION PROCESSES | Final Rejection | LAM RESEARCH CORPORATION |
| 18390078 | APPARATUS FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18545660 | APPARATUS FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18515867 | SUBSTRATE HEATER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18119882 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | SEMES CO., LTD. |
| 18369967 | DELAYERING APPARATUS AND METHODS | Non-Final OA | FEI Company |
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