DETAILED ACTION
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Arguments
Applicant's arguments filed 07/06/2026 have been fully considered but they are not persuasive.
Regarding the applicant’s arguments that the prior art fails to disclose determining an optical characteristic of the radiation beam received by a sensor on a substrate table at a plurality of instants during the displacement of the one or more moveable components, the Examiner respectfully disagrees.
Attention is brought to paragraphs 48-51 of Leenders, wherein a system and method for “monitoring and calibrating” the positioning of a mask table, a wafer table and a plurality of projection devices, is explicitly disclosed. Specifically, the term “monitoring” may be understood as being a continuous process that occurs over time. Further, the disclosed “3D parabolic-like light intensity distribution” is measured and observed to determine an “optimal 6 DOF-alignment” of the system. This optimal alignment also includes the measurements of errors associated with each projection device (10) of the system. Each of the positions of the projection devices is “adjusted” and an overall error is computed by the processing unit (par. 50). Further, Leenders explicitly discloses in paragraph 51, that “a time signal” representing the measured errors may be generated and utilized to obtain optimal alignment of the system. Therefore, the prior art is understood to explicitly disclose the claimed “determining an optical characteristic of the radiation beam received by a sensor on a substrate table at a plurality of instants during the displacement of the one or more moveable components”.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-9, 11-21 are rejected under 35 U.S.C. 102(a1) as being anticipated by EP 1,469,348 to Leenders et al. (provided by applicant).
Regarding claims 1-9, 11-21, Leenders discloses and shows in Figures 1-3b, a system and method of spatially aligning a patterning device and a substrate, wherein the patterning device and the substrate are separated by an optical path comprising one or more moveable optical components (par. 5, 27, 33), the method comprising:
projecting a radiation beam (PB) from the patterning device (MT, M1) along the optical path (Figure 3b) (par. 31, 48-51);
performing a displacement of the one or more moveable optical components (10) along a predetermined trajectory (Figure 2) (par. 33, 48-51);
determining an optical characteristic of the radiation beam as received by a sensor (52) on a substrate table (WT) supporting the substrate (W) at a plurality of instants during the displacement of the one or more moveable optical components (par. 33, 35, 37-38, 48-51; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table); and
spatially aligning the patterning device and the substrate based on the optical characteristic as determined at the plurality of instants (par. 37-40, 48-51; wherein positioning errors of the optical elements, the mask table and the wafer table, are measured, and stored to create a control loop database, which is used to correct for positioning errors in the processing of wafers);
[claim 2] wherein the radiation beam is a patterned radiation beam comprising a pattern of a marker arranged on the patterning device (par. 49; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 3] wherein the optical characteristic is an intensity of the patterned radiation beam (par. 49; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 4] performing a displacement of the substrate table along a further predetermined trajectory, the displacement of the substrate table causing a displacement of the substrate table relative to the radiation beam (Figure 1) (par. 5, 27, 31-32, 40, 42, 46, 51; wherein the wafer table is movable in multiple dimensions and is displaced to provide additional error compensation and allow improved image quality);
[claim 5] wherein the displacement of the substrate table relative to the radiation beam comprises a plurality of substantially horizontal displacements at a respective plurality of different vertical positions (Figure 1) (par. 5, 27, 31-32, 40, 42, 46, 51; wherein the wafer table is movable in multiple dimensions and is displaced to provide additional error compensation and allow improved image quality);
[claim 6] wherein the displacement of the one or more moveable optical components causes a displacement of an aerial image of the radiation beam relative to the substrate table, and wherein the displacement of the substrate table relative to the radiation beam at least partly compensates or follows the displacement of the aerial image of the radiation beam relative to the substrate table as caused by the displacement of the one or more moveable optical components (par. 33, 35, 37-38, 48-51; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 7] wherein the predetermined trajectory at least spans one period of a cyclic error of a position measurement of the one or more moveable optical components (par. 33, 35, 37-38, 48-51; wherein various control and feedback algorithms are disclosed in order to compensate and minimize errors associated with position, velocity, acceleration and time (applicant’s cyclic errors) (par. 38); further residual errors that remain after adjustment of the projection devices (10) may be compensated for by adjusting the position of the wafer table or mask table (par. 50));
[claim 8] wherein the displacement of the one or more moveable optical components along the predetermined trajectory causes a sequence of a plurality of substantially horizontal displacements of an aerial image of the radiation beam relative to the substrate table (par. 33, 35, 37-38, 48-51; wherein the optical elements include actuator mounts with six degrees of freedom; and wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 9] performing a substantially vertical displacement of the substrate table during the displacement of the one or more moveable optical components (Figure 1) (par. 5, 27, 31-32, 40, 42, 46, 51; wherein the wafer table is movable in multiple dimensions and is displaced to provide additional error compensation and allow improved image quality);
[claims 11-12] an apparatus comprising:
a mask table (MT) (applicant’s support structure) configured to support a mask (M1) (applicant’s patterning device) (Figure 1, 3b) (par. 5, 27, 31-32, 40, 42, 46);
a substrate table (WT) configured to support a substrate (W) (Figure 1, 3b) (par. 5, 27, 31-32, 40, 42, 46);
a projection system (PL) comprising a plurality of moveable optical components (10), the moveable optical components providing an optical path between the patterning device and the substrate (Figure 1, 3b) (par. 5, 27, 31-32, 40, 42, 49);
a positioning system (PM) configured to position the patterning device (PM), the substrate (PW) and the moveable optical components of the projection system (12) (Figure 1, 3b) (par. 5, 27, 31-32, 40, 42, 49);
a position measurement system (47, 48, 52) configured to measure a position of the support structure, the substrate table and the moveable optical components of the projection system (par. 33, 35, 42, 49);
a control unit (40), the control unit being configured to control the positioning system (par. 35-36),
wherein the apparatus is configured to receive a radiation beam to irradiate the patterning device and wherein the control unit is configured to control the apparatus to perform the method of spatially aligning the patterning device and the substrate (par. 33, 35, 37-38, 48-51; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 13] wherein the predetermined trajectory at least spans one period of a cyclic error of the position measurement system (par. 33, 35, 37-38, 48-51; wherein various control and feedback algorithms are disclosed in order to compensate and minimize errors associated with position, velocity, acceleration and time (applicant’s cyclic errors) (par. 38); further residual errors that remain after adjustment of the projection devices (10) may be compensated for by adjusting the position of the wafer table or mask table (par. 50));
[claim 14] a radiation source (30, LA) and an illumination system (IL) for generating the radiation beam (Figures 1, 3b) (par. 25, 27, 29, 49);
[claim 15] wherein the radiation source is an EUV radiation source and/or wherein the moveable optical components are EUV mirrors (par. 25, 27, 29);
[claim 16] wherein the radiation beam is a patterned radiation beam comprising a pattern of a marker arranged on the patterning device (par. 33, 35, 37-38, 48-51; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 17] further comprising a position measurement system (47, 48, 52) configured to measure a position of the support structure, the substrate table and the moveable optical components of the projection system (par. 33, 35, 42, 49);
[claim 18] wherein the predetermined trajectory at least spans one period of a cyclic error of the position measurement system (par. 33, 35, 37-38, 48-51; wherein various control and feedback algorithms are disclosed in order to compensate and minimize errors associated with position, velocity, acceleration and time (applicant’s cyclic errors) (par. 38); further residual errors that remain after adjustment of the projection devices (10) may be compensated for by adjusting the position of the wafer table or mask table (par. 50));
[claim 19] wherein the optical characteristic is an intensity of the patterned radiation beam (par. 33, 35, 37-38, 48-51; wherein a sensor 52 is utilized in a calibration step to monitor an image of a “3D parabolic-like light intensity distribution” of a test mark 51, to find the optimal alignment of projection optical elements, the mask table and the wafer table);
[claim 20] wherein the control unit is further configured to cause performance of a displacement of the substrate table along a further predetermined trajectory, the displacement of the substrate table causing a displacement of the substrate table relative to the radiation beam (Figure 1) (par. 5, 27, 31-32, 40, 42, 46, 51; wherein the wafer table is movable in multiple dimensions and is displaced to provide additional error compensation and allow improved image quality);
[claim 21] wherein the system and method further comprises: a processing unit (40), as a generic computer having multiple processors for executing various instructions (par. 35-38).
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JONATHAN M HANSEN whose telephone number is (571)270-1736. The examiner can normally be reached Monday to Friday, 8am to 4pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Michelle Iacoletti can be reached at 571-270-5789. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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JONATHAN M. HANSEN
Primary Examiner
Art Unit 2877
/JONATHAN M HANSEN/Primary Examiner, Art Unit 2877
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