Prosecution Insights
Last updated: October 02, 2026
Application No. 18/867,945

ETCHING METHOD

Non-Final OA §102
Filed
Nov 21, 2024
Priority
May 31, 2022 — JP 2022-089057 +1 more
Examiner
DEO, DUY VU NGUYEN
Art Unit
Tech Center
Assignee
RESONAC Corporation
OA Round
1 (Non-Final)
82%
Grant Probability
Favorable
1-2
OA Rounds
6m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
864 granted / 1049 resolved
+22.4% vs TC avg
Moderate +7% lift
Without
With
+7.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
35 currently pending
Career history
1063
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
44.9%
+4.9% vs TC avg
§102
26.7%
-13.3% vs TC avg
§112
13.7%
-26.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1049 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 3-7 is/are rejected under 35 U.S.C. 102a1 as being anticipated by Shimizu et al. (US 2021/0391178A1). With respect to claims 1, 3, 4 Shimizu teaches an etching method comprising selectively etching a silicon material including silicon oxide and/or polysilicon film or claimed etching object over non-etching object has a carbon material including an amorphous carbon film and/or photoresist (para 16, 18) using an etching compound comprising a sulfur-containing fluorocarbon compound CxFySz, for example x=2, y =4 (para 8; 29, 30). The etching composition doesn’t have any type of metals of claimed 1. With respect to claims 5-7, the etching composition further includes tetrafluoromethane CF4, difluoromethane CH2F2 and an inert gas (para 34, 36, 37). Allowable Subject Matter Claims 2, 8-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claims 2 and its dependent claims 8-12 are allowed because Shimizu, while teaches the use of sulfur-containing fluorocarbon or fluoro-dithiethane; however, he fails to teach that the fluoro-dithiethane has at least one type among 2,2,4,4-tetrafluoro-1,3-dithietane, 1,1,2,2,3,3,4,4-octafluoro-1,3- dithietane, 2,2,4-trifluoro-4-trifluoromethyl-1,3-dithietane, 2,4-difluoro-2,4-bis(trifluoromethyl)- 1,3-dithietane, and 2,2,4,4-tetrakis(trifluoromethyl)-1,3-dithietane. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DUY VU NGUYEN DEO whose telephone number is (571)272-1462. The examiner can normally be reached 9-5 M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Allen can be reached at 571-272-3176. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DUY VU N DEO/Primary Examiner, Art Unit 1713 8/17/2026
Read full office action

Prosecution Timeline

Nov 21, 2024
Application Filed
Aug 19, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12745582
METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON WAFER, AND SILICON WAFER
3y 1m to grant Granted Sep 22, 2026
Patent 12745610
Implant Hard Mask for Substrates
2y 8m to grant Granted Sep 22, 2026
Patent 12727412
ETCHING COMPOSITIONS
3y 6m to grant Granted Sep 01, 2026
Patent 12727414
METHOD FOR PROCESSING A SUBSTRATE
2y 5m to grant Granted Sep 01, 2026
Patent 12713528
DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
2y 9m to grant Granted Aug 18, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
82%
Grant Probability
90%
With Interview (+7.3%)
2y 4m (~6m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1049 resolved cases by this examiner. Grant probability derived from career allowance rate.

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