Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1716 1792 1794 2817
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18947090 | ETCHING COMPOSITIONS, METHODS OF TREATING SUBSTRATES USING THE SAME, AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18808281 | COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OBJECT TO BE TREATED, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | Non-Final OA | FUJIFILM Corporation |
| 18800584 | COMPOSITION, COMPOUND, RESIN, SUBSTRATE TREATMENT METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18651935 | METHOD, SYSTEM AND APPARATUS FOR SURFACE MODIFICATION | Non-Final OA | ASM IP Holding B.V. |
| 18779815 | ETCHING COMPOSITIONS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18780440 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18654400 | CONDITIONING PAD WITH DEPOSITED DIAMOND COATING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18626386 | SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18773292 | SELF-HEALING POLISHING PAD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18847897 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18626693 | SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18827593 | METHOD FOR MANUFACTURING PROCESSED SUBSTRATE | Non-Final OA | MERCK PATENT GMBH |
| 18659602 | ETCHING SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 18839177 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | Non-Final OA | Lam Research Corporation |
| 18771442 | EFFICIENT CLEANING AND ETCHING OF HIGH ASPECT RATIO STRUCTURES | Non-Final OA | LAM RESEARCH CORPORATION |
| 18857335 | ABRASIVE GRAIN, SELECTION METHOD THEREFOR, POLISHING AGENT, MULTI-LIQUID POLISHING AGENT, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Non-Final OA | Resonac Corporation |
| 18856465 | CMP POLISHING LIQUID AND POLISHING METHOD | Non-Final OA | Resonac Corporation |
| 18294859 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD | Non-Final OA | Resonac Corporation |
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