Tech Center 1700 • Art Units: 1713 1716 1792
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18360930 | METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18550235 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18620041 | METHOD FOR MAKING A HIGH ASPECT RATIO TRENCH | Non-Final OA | STMicroelectronics International N.V. |
| 18410811 | DEVICE FABRICATION METHODS WITH ION BEAM PROCESSING | Non-Final OA | Tokyo Electron Limited |
| 18406670 | METHOD AND SYSTEM FOR PLASMA PROCESS | Non-Final OA | Tokyo Electron Limited |
| 17708596 | SEMICONDUCTOR TREATMENT LIQUID | Final Rejection | TOKUYAMA CORPORATION |
| 18035865 | PLASMA-ACTIVATED LIQUIDS | Final Rejection | The Board of Trustees of the University of Illinois |
| 18278071 | METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON WAFER, AND SILICON WAFER | Final Rejection | SHIN-ETSU HANDOTAI CO., LTD. |
| 18757184 | ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTRAVIOLET LITHOGRAPHY RESIST IMPROVEMENT | Non-Final OA | Lam Research Corporation |
| 18291036 | PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES | Non-Final OA | Versum Materials US, LLC |
| 18276355 | CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME | Final Rejection | ARACA, INC. |
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