Prosecution Insights
Last updated: July 17, 2026
Application No. 18/949,248

SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD

Non-Final OA
Filed
Nov 15, 2024
Priority
Nov 16, 2023 — JP 2023-194973
Examiner
LEE, DOUGLAS
Art Unit
1714
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Tokyo Electron Limited
OA Round
1 (Non-Final)
45%
Grant Probability
Moderate
1-2
OA Rounds
1y 10m
Est. Remaining
59%
With Interview

Examiner Intelligence

Grants 45% of resolved cases
45%
Career Allowance Rate
300 granted / 668 resolved
-20.1% vs TC avg
Moderate +14% lift
Without
With
+13.7%
Interview Lift
resolved cases with interview
Typical timeline
3y 6m
Avg Prosecution
35 currently pending
Career history
699
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
93.8%
+53.8% vs TC avg
§102
0.7%
-39.3% vs TC avg
§112
1.9%
-38.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 668 resolved cases

Prosecution Timeline

Nov 15, 2024
Application Filed
May 20, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685061
APPARATUS AND METHOD FOR REMOVAL OF OXIDE AND CARBON FROM SEMICONDUCTOR FILMS IN A SINGLE PROCESSING CHAMBER
3y 11m to grant Granted Jul 14, 2026
Patent 12667633
AQUEOUS OZONE FLOOR DISINFECTION SYSTEM
2y 2m to grant Granted Jun 30, 2026
Patent 12660909
MULTIPURPOSE CLEANING TOOL
2y 5m to grant Granted Jun 23, 2026
Patent 12653367
CLEANING BASE AND CLEANING SYSTEM
2y 5m to grant Granted Jun 16, 2026
Patent 12637775
HYBRID DESCALING SYSTEM WITH ACID INJECTION
2y 2m to grant Granted May 26, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
45%
Grant Probability
59%
With Interview (+13.7%)
3y 6m (~1y 10m remaining)
Median Time to Grant
Low
PTA Risk
Based on 668 resolved cases by this examiner. Grant probability derived from career allowance rate.

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