Prosecution Insights
Last updated: October 25, 2026
Application No. 19/035,096

SUBSTRATE STRUCTURE

Non-Final OA §102§OTHER
Filed
Jan 23, 2025
Priority
Apr 21, 2023 — TW 112114941 +1 more
Examiner
DEO, DUY VU NGUYEN
Art Unit
1784
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Unimicron Technology Corp.
OA Round
1 (Non-Final)
82%
Grant Probability
Favorable
1-2
OA Rounds
7m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
870 granted / 1055 resolved
+17.5% vs TC avg
Moderate +7% lift
Without
With
+7.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
34 currently pending
Career history
1085
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
44.5%
+4.5% vs TC avg
§102
27.1%
-12.9% vs TC avg
§112
13.8%
-26.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1055 resolved cases

Office Action

§102 §OTHER
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Drawings The drawings are objected to under 37 CFR 1.83(a) because they fail to show “notch 100D”, as described in para 74 of the specification for fig. 8a to 8c. Any structural detail that is essential for a proper understanding of the disclosed invention should be shown in the drawing. MPEP § 608.02(d). Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance. Claim 5 recites the limitation "a depth of the notch". There is insufficient antecedent basis for this limitation in the claim. It appears that claim 5 should depend on claim 4, which cites a notch. For the purpose of examination, claim 5 is considered to depend on claim 4. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 2 is/are rejected under 35 U.S.C. 102a1 as being anticipated by WO2020241805A1 (referred below as WO ‘805). With respect to claim 1, WO ‘805 describes a glass substrate comprising providing a glass substrate having a top and bottom surface, a protective film or claimed redistribution layer on the substrate since under the broadest reasonable interpretation, any layer can provide a retribution layer, see MPEP 2111 (claim 3; page 4, 5 of the translation); altered portions formed by performing laser process step I in the glass substrate extending from the inner surface toward the main surfaces or claimed scribed surface, wherein the altered portion forms the hole 20; fig. 1 and 2 show hole 20 has arc shape and protrudes outward to the main surfaces; therefore, the altered portions or scribed surface, when formed between the mains surfaces, would also have an arc profile and protrude outward from the middle of the glass substrate (claims 6-8; page 4, 5 of the translation; fig. 1, 2). PNG media_image1.png 396 436 media_image1.png Greyscale PNG media_image2.png 396 428 media_image2.png Greyscale The alter portions or claimed scribed surface, formed by the same process of using a pulse laser (page 4). Therefore, the alter portions by the laser would have a surface with lower light transmittance than that of either the top or bottom surface of the glass substrate. With respect to claim 2, fig. 2 shows the top corner of the hole 20 has a curved arc shape or claimed a full or half bullnose profile. PNG media_image3.png 396 428 media_image3.png Greyscale . Allowable Subject Matter Claims 3-5 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. With respect to claim 3, WO’ 805 doesn’t describe the scribed surface has at least one stepped-portion, and the at least one stepped-portion protrudes outward from middle of the glass substrate. With respect to claim 4, and its dependent claim 5, WO’ 805 doesn’t describe the glass substrate further has a notch adjacent to the scribed surface, and light transmittance of a sidewall of the notch is lower than the light transmittance of either the top surface or the bottom surface. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DUY VU NGUYEN DEO whose telephone number is (571)272-1462. The examiner can normally be reached 9-5 M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Allen can be reached on 571-272-3176. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DUY VU N DEO/Primary Examiner, Art Unit 1713 10/1/2026
Read full office action

Prosecution Timeline

Jan 23, 2025
Application Filed
Oct 05, 2026
Non-Final Rejection mailed — §102, §OTHER (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12772772
MITIGATION OF FIRST WAFER EFFECT
2y 5m to grant Granted Oct 20, 2026
Patent 12753342
COMPOSITION AND METHOD FOR TREATING SUBSTRATE
3y 0m to grant Granted Oct 06, 2026
Patent 12745582
METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON WAFER, AND SILICON WAFER
3y 1m to grant Granted Sep 22, 2026
Patent 12745610
Implant Hard Mask for Substrates
2y 8m to grant Granted Sep 22, 2026
Patent 12727412
ETCHING COMPOSITIONS
3y 6m to grant Granted Sep 01, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
82%
Grant Probability
90%
With Interview (+7.3%)
2y 4m (~7m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1055 resolved cases by this examiner. Grant probability derived from career allowance rate.

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