Prosecution Insights
Last updated: July 17, 2026
Application No. 19/085,129

Substrate Processing Apparatus, Gas Supply Assembly, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-Readable Recording Medium

Non-Final OA §102
Filed
Mar 20, 2025
Priority
Sep 20, 2022 — JP 2022-149628 +1 more
Examiner
MILLER, MICHAEL G
Art Unit
1712
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Kokusai Electric Corporation
OA Round
1 (Non-Final)
52%
Grant Probability
Moderate
1-2
OA Rounds
2y 8m
Est. Remaining
68%
With Interview

Examiner Intelligence

Grants 52% of resolved cases
52%
Career Allowance Rate
330 granted / 640 resolved
-13.4% vs TC avg
Strong +16% interview lift
Without
With
+16.2%
Interview Lift
resolved cases with interview
Typical timeline
4y 0m
Avg Prosecution
20 currently pending
Career history
656
Total Applications
across all art units

Statute-Specific Performance

§103
84.5%
+44.5% vs TC avg
§102
6.7%
-33.3% vs TC avg
§112
5.8%
-34.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 640 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-4, 6-8, and 14-20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by JP 2006-342386 (hereinafter JP ‘386). Claims 1 and 17-20 - JP ‘386 discloses a substrate processing device comprising: a gas supply pipe 232 corresponding to a first gas supply portion for supplying a first gas; a first member comprising a seal cap 219 for causing the first gas to flow from the first gas supply portion; a second member comprising a cylinder 301 including flanges 302, 303 for causing the first gas to flow from the first member; a third member comprising a flange 351 for causing the first gas to flow from the second member; a processing chamber 201 to which the first gas from the third member is supplied; a first seal member comprising an O-ring 341 that is positioned between the first member and the second member; a second seal member comprising an O-ring 340 that is positioned between the second member and the third member; a second gas supply unit that supplies air or N2 and supplies a second gas; a cooling water path 311 that is disposed along the second seal member and corresponds to a first gas path through which the second gas flows; and a cooling water path 312 that is disposed along the first seal member and corresponds to a second gas path through which the second gas flows. (page 4, machine translation, paragraphs 3-6). JP ‘386 also discloses a gas supply unit (as above), a method for manufacturing a semiconductor device (pages 4-6), and a program that is executed by the substrate processing apparatus (Page 4, the MFCs necessitate computer control). Therefore Claims 1 and 17-20 are anticipated. Claim 2 – JP ‘386 further anticipates the limitation wherein the invention comprises a cooling water path 313 corresponding to a third gas path through which the second gas flows between the first gas path and the second gas path (page 4, machine translation, paragraphs 3-6, and fig. 4). Claim 3 – JP ‘386 further anticipates the limitation wherein the first gas path is provided between the second member and the third member (fig. 4). Claim 4 – JP ‘386 further anticipates the limitation wherein the second gas path is provided between the first member and the second member (fig. 4). Claim 6 – JP ‘386 further anticipates the limitation wherein the first gas supply portion is connected to the first member (fig. 3). Claim 7 – JP ‘386 further anticipates the limitation wherein the invention comprises cooling water discharge paths 311-313 corresponding to the discharge portion for discharging the second gas (page 4, machine translation, paragraphs 3-6-). Claim 8 – JP ‘386 further anticipates the limitation wherein the first gas is a processing gas (page 4, machine translation, paragraphs 3-6, and fig. 3) Claim 15 – JP ‘386 further anticipates the limitation wherein the second gas is a purge gas (page 4, machine translation, paragraphs 3-6, and fig. 5) Claim 16 – JP ‘386 further anticipates the limitation wherein the third member includes a housing that forms the processing chamber (fig. 3-4). Allowable Subject Matter Claims 5, 7, and 9-14 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The limitations in claims 5, 7, and 9-14 individually are not found in the prior art in a configuration compatible with the cited reference. Further, the advantage of reducing the risk of oxygen permeation derived from the limitations removes design choice and routine optimization as permissible rationales to rearrange the apparatus to comply with the limitations. References of Record Examiner cites US PGPubs 2015/0140835, 2008/0088097, and 2004/0149224 as references of record in the instant application. The references are to substrate processing apparatuses of the type discussed in the applied prior art and are of general relevance to the claimed inventions. These references are not being replied on as the basis of any rejection. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MICHAEL G MILLER whose telephone number is (571)270-1861. The examiner can normally be reached M-F 9:00-5:30 EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Michael Cleveland can be reached at 571-272-1418. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MICHAEL G MILLER/ Primary Examiner, Art Unit 1712
Read full office action

Prosecution Timeline

Mar 20, 2025
Application Filed
Jun 29, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685118
METHODS AND SYSTEMS FOR FILLING A GAP
3y 9m to grant Granted Jul 14, 2026
Patent 12662584
Healable and Recyclable Polyimide Polymer Resin, Healing Method and Recycling Method Thereof
1y 4m to grant Granted Jun 23, 2026
Patent 12660527
FILM FORMATION METHOD AND PLASMA PROCESSING METHOD
3y 9m to grant Granted Jun 16, 2026
Patent 12644181
NOVEL COMPOSITION, PRECURSOR COMPOSITION INCLUDING SAME, AND METHOD OF MANUFACTURING THIN FILM USING SAME PRECURSOR COMPOSITION
1y 9m to grant Granted Jun 02, 2026
Patent 12648377
METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, FILM FORMING APPARATUS, AND RECORDING MEDIUM
1y 9m to grant Granted Jun 02, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
52%
Grant Probability
68%
With Interview (+16.2%)
4y 0m (~2y 8m remaining)
Median Time to Grant
Low
PTA Risk
Based on 640 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month