Prosecution Insights
Last updated: July 17, 2026
Application No. 19/290,768

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

Non-Final OA
Filed
Aug 05, 2025
Priority
Oct 22, 2021 — JP 2021-173405 +1 more
Examiner
ALANKO, ANITA KAREN
Art Unit
1713
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Tokyo Electron Limited
OA Round
1 (Non-Final)
70%
Grant Probability
Favorable
1-2
OA Rounds
2y 0m
Est. Remaining
52%
With Interview

Examiner Intelligence

Grants 70% — above average
70%
Career Allowance Rate
483 granted / 693 resolved
+4.7% vs TC avg
Minimal -17% lift
Without
With
+-17.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 12m
Avg Prosecution
35 currently pending
Career history
729
Total Applications
across all art units

Statute-Specific Performance

§101
0.6%
-39.4% vs TC avg
§103
67.2%
+27.2% vs TC avg
§102
9.9%
-30.1% vs TC avg
§112
9.8%
-30.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 693 resolved cases

Prosecution Timeline

Aug 05, 2025
Application Filed
May 07, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12680021
Composition, Its Use And A Process For Selectively Etching Silicon-Germanium Material
3y 4m to grant Granted Jul 14, 2026
Patent 12685199
SYSTEMS AND METHODS FOR FABRICATING A 2-D-MATERIAL-BASED QUANTUM SENSOR CHIP
3y 1m to grant Granted Jul 14, 2026
Patent 12648404
SEMICONDUCTOR WAFER PROCESSING METHOD
2y 9m to grant Granted Jun 02, 2026
Patent 12648380
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
2y 10m to grant Granted Jun 02, 2026
Patent 12642022
Plasma Etching
3y 5m to grant Granted May 26, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
70%
Grant Probability
52%
With Interview (-17.4%)
2y 12m (~2y 0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 693 resolved cases by this examiner. Grant probability derived from career allowance rate.

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