Tech Center 1700 • Art Units: 1713 1716 1792
This examiner grants 69% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18610982 | METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18376034 | ETCHING GAS AND ETCHING METHOD USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18688600 | Microfabricated Multiemitter Electrospray Thrusters | Non-Final OA | The Regents of the University of California |
| 18698175 | METHOD FOR PREPARING METAL MESH AND METHOD FOR PREPARING ANTENNA | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18291913 | SENSING DEVICE AND PREPARATION METHOD THEREFOR | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18299850 | PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY | Non-Final OA | Texas Instruments Incorporated |
| 17965554 | TREATMENT LIQUID, CHEMICAL MECHANICAL POLISHING METHOD, AND METHOD FOR TREATING SEMICONDUCTOR SUBSTRATE | Final Rejection | FUJIFILM Corporation |
| 18313607 | MASK ASSEMBLY, METHOD OF MANUFACTURING MASK ASSEMBLY, AND METHOD OF MANUFACTURING DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18316423 | SINGLE CRYSTAL SILICON SUBSTRATE, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING SINGLE CRYSTAL SILICON SUBSTRATE | Non-Final OA | SEIKO EPSON CORPORATION |
| 19177677 | CHEMICAL MECHANICAL POLISHING METHOD | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18008358 | FABRICATION OF OPTICAL ELEMENTS | Non-Final OA | Board of Regents, The University of Texas System |
| 18611755 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 19109380 | PRODUCTION METHOD FOR ETCHING LIQUID COMPOSITION | Non-Final OA | Kao Corporation |
| 18031801 | ETCHING GAS, METHOD FOR PRODUCING SAME, ETCHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Non-Final OA | Resonac Corporation |
| 18031471 | ETCHING GAS, METHOD FOR PRODUCING SAME, ETCHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Non-Final OA | Resonac Corporation |
| 18696009 | Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additives For Chemical Mechanical Planarization Slurries | Non-Final OA | Versum Materials US, LLC |
| 18191652 | SILICON ETCHANT AND SILICON ETCHING METHOD | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 18696793 | POLISHING COMPOSITION | Non-Final OA | FUJIMI INCORPORATED |
| 18605224 | POLISHING COMPOSITION, POLISHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | Non-Final OA | FUJIMI INCORPORATED |
| 18688101 | POLISHING COMPOSITION | Non-Final OA | FUJIMI INCORPORATED |
| 18616347 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | Non-Final OA | Fujifilm Electronic Materials U.S.A., Inc. |
| 18626373 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18686826 | GENERATION OF MULTILINE ETCH SUBSTRATES | Non-Final OA | Geminatio, Inc. |
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