Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1713 1716 1792 2874 2884 2896 3794
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18640332 | SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18376034 | ETCHING GAS AND ETCHING METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18698175 | METHOD FOR PREPARING METAL MESH AND METHOD FOR PREPARING ANTENNA | Final Rejection | BOE Technology Group Co., Ltd. |
| 18616347 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | Final Rejection | Fujifilm Electronic Materials U.S.A., Inc. |
| 18688600 | Microfabricated Multiemitter Electrospray Thrusters | Final Rejection | The Regents of the University of California |
| 18423888 | OPTICAL SIGNAL REDIRECTION STRUCTURE FOR PHOTONICS DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18805783 | SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIAL | Non-Final OA | Applied Materials, Inc. |
| 18783581 | METHOD OF INTEGRATED COPPER OXIDE REMOVAL AND LOW K REPAIR PROCESS | Non-Final OA | Applied Materials, Inc. |
| 18636684 | CONTROLLED ETCH OF SILICON NITRIDE MATERIAL | Non-Final OA | Applied Materials, Inc. |
| 18615556 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Research & Business Foundation SUNGKYUNKWAN UNIVERSITY |
| 18764779 | SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18607272 | COMPOSITION AND METHOD FOR SELECTIVELY ETCHING SILICON NITRIDE | Non-Final OA | ENTEGRIS, INC. |
| 17784228 | CHEMICAL-MECHANICAL POLISHING COMPOSITION AND CHEMICAL-MECHANICAL POLISHING METHOD USING THE SAME | Non-Final OA | ENTEGRIS, INC. |
| 18696009 | Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additives For Chemical Mechanical Planarization Slurries | Non-Final OA | Versum Materials US, LLC |
| 18849771 | POLISHING COMPOSITION | Non-Final OA | FUJIMI INCORPORATED |
| 18696793 | POLISHING COMPOSITION | Final Rejection | FUJIMI INCORPORATED |
| 18605224 | POLISHING COMPOSITION, POLISHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | Final Rejection | FUJIMI INCORPORATED |
| 18818710 | APPARATUS FOR CONTROLLING IMPEDANCE AND SYSTEM FOR TREATING SUBSTRATE WITH THE APPARATUS | Non-Final OA | SEMES Co., Ltd. |
| 18332233 | ETCHING GAS COMPOSITION, SUBSTRATE PROCESSING APPARATUS, AND PATTERN FORMING METHOD USING THE ETCHING GAS COMPOSITION | Final Rejection | SEMES CO., LTD. |
| 18795161 | SURFACTANTS FOR ELECTRONICS | Final Rejection | AdvanSix Resins & Chemicals LLC |
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