1 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18072686 | Method and Apparatus for Achieving Package-Level Chip-Scale Packaging that Allows for the Incorporation of In-Package Integrated Passives | MULERO FLORES, ERIC MANUEL | 2898 | Final Rejection | Nov 30, 2022 |
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