Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18671649 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18335336 | PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17957446 | RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18248497 | DISPLAY DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18076374 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17643263 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18325377 | INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17834274 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18170581 | SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 17831810 | SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES | Final Rejection | Sandisk Technologies, Inc. |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17560332 | SRAM BIT CELLS | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
| 18206579 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17821790 | LIGHT EMITTING DEVICE | Final Rejection | Lextar Electronics Corporation |
| 18009984 | MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SHINKAWA LTD. |
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