Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 83% of resolved cases
Examiner Eric Manuel Mulero Flores has resolved 72 cases in Art Unit 2898. Within Tech Center 2800, the data shows an allowance rate of 83.3 percent for these 72 cases. This 83.3 percent rate serves as a baseline for practitioners to understand the outcomes of applications processed by this examiner.
The median days to allowance is 1201. This 1201 day figure represents the median duration for applications that reach a grant. Practitioners should use this 1201 day metric to set expectations for the timeline of prosecution in Art Unit 2898.
The interview lift is 16.4 percent, which indicates an increase in the probability of allowance when an interview is conducted relative to the 83.3 percent base rate. This 16.4 percent lift suggests that interviews are associated with an increased probability of allowance. The 16.4 percent lift is a factor to consider when determining whether to engage in direct communication in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18335336 | PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17475506 | INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18058006 | Harvested Reconstitution Bumping | Non-Final OA | Apple Inc. |
| 18756082 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18740336 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18422885 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17772715 | FORMATION OF MICROLED MESA STRUCTURES WITH ATOMIC LAYER DEPOSITION PASSIVATED SIDEWALLS, A SELF-ALIGNED DIELECTRIC VIA TO THE TOP ELECTRICAL CONTACT, AND A PLASMA-DAMAGE-FREE TOP CONTACT | Non-Final OA | The Regents of the University of California |
| 18248497 | DISPLAY DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18325377 | INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18595303 | STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 17957446 | RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18677746 | METHOD OF FABRICATING SEMICONDUCTOR SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18583044 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18595286 | REPLACEMENT SOURCE/DRAIN CONTACT METHOD IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18422890 | SEMICONDUCTOR DEVICE | Non-Final OA | Nuvoton Technology Corporation |
| 18624147 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18381889 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18422617 | Anti-Reflective Layer for Protecting an N-Polar Group III-Nitride Semiconductor Structure | Final Rejection | Wolfspeed, Inc. |
| 17831810 | SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES | Non-Final OA | Sandisk Technologies, Inc. |
| 18009984 | MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Final Rejection | SHINKAWA LTD. |
| 18206579 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18079170 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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