Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17475506 | INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18058006 | Harvested Reconstitution Bumping | Non-Final OA | Apple Inc. |
| 18248497 | DISPLAY DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18740336 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18422885 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17772715 | FORMATION OF MICROLED MESA STRUCTURES WITH ATOMIC LAYER DEPOSITION PASSIVATED SIDEWALLS, A SELF-ALIGNED DIELECTRIC VIA TO THE TOP ELECTRICAL CONTACT, AND A PLASMA-DAMAGE-FREE TOP CONTACT | Non-Final OA | The Regents of the University of California |
| 18170581 | SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 18405394 | SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS | Non-Final OA | Mitsubishi Electric Corporation |
| 18015085 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER | Non-Final OA | Mitsubishi Electric Corporation |
| 17957446 | RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18677746 | METHOD OF FABRICATING SEMICONDUCTOR SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17882655 | SEMICONDUCTOR PACKAGE WITH A STACKED FILM STRUCTURE TO REDUCE CRACKING AND DELAMINATION AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17831810 | SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES | Non-Final OA | Sandisk Technologies, Inc. |
| 18624147 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18422890 | SEMICONDUCTOR DEVICE | Non-Final OA | Nuvoton Technology Corporation |
| 18517178 | SEMICONDUCTOR DEVICE | Non-Final OA | NEXPERIA B.V. |
| 17560332 | SRAM BIT CELLS | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
| 18079170 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18169996 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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