Tech Center 2800 • Art Units: 2898
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18671649 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18335336 | PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17772715 | FORMATION OF MICROLED MESA STRUCTURES WITH ATOMIC LAYER DEPOSITION PASSIVATED SIDEWALLS, A SELF-ALIGNED DIELECTRIC VIA TO THE TOP ELECTRICAL CONTACT, AND A PLASMA-DAMAGE-FREE TOP CONTACT | Final Rejection | The Regents of the University of California |
| 18015085 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER | Final Rejection | Mitsubishi Electric Corporation |
| 18354769 | FIELD EFFECT TRANSISTOR | Non-Final OA | DENSO CORPORATION |
| 18248497 | DISPLAY DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18058006 | Harvested Reconstitution Bumping | Final Rejection | Apple Inc. |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17834274 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18076374 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17643263 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18325377 | INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18206579 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17831810 | SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES | Final Rejection | Sandisk Technologies, Inc. |
| 18170581 | SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 18381889 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18169996 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18079170 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 17821790 | LIGHT EMITTING DEVICE | Non-Final OA | Lextar Electronics Corporation |
| 18009984 | MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SHINKAWA LTD. |
| 17707703 | HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR ADVANCED IC | Non-Final OA | nD-HI Technologies Lab, Inc. |
| 18072686 | Method and Apparatus for Achieving Package-Level Chip-Scale Packaging that Allows for the Incorporation of In-Package Integrated Passives | Final Rejection | Atlas Magnetics Inc. |
| 17935616 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN JIDIAN (BEIJING) MEMORY TECHNOLOGIES CO., LTD. |
| 17617561 | A PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, A METHOD OF TRANSFERRING AN LED CHIP USING THE PHOTOSENSITIVE TRANSFER RESIN, AND A METHOD OF MANUFACTURING A DISPLAY DEVICE USING THE SAME | Non-Final OA | AGASemicon Corp. |
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