4 pending office actions • 1 art units • 4 examiners • 0 of 4 (0%) have an AI response strategy ready • 45 patents granted in the last 365 days
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 2 (50%) |
| §102 only | 2 (50%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SANDHU, AMRITBIR K | 1 | 82.8% | +10.9% |
| ALHAWAMDEH, NADER J | 1 | 91.7% | +10.1% |
| ANDERSON, AMARA | 1 | 86.3% | +16.7% |
| LEON MUNOZ, EDWIN A | 1 | 88.4% | +8.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18896335 | CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOELECTRONIC SWITCH CHIP | SANDHU, AMRITBIR K | — |
| 18749832 | CONNECTOR ASSEMBLY WITH HEAT DISSIPATION PLATE | ALHAWAMDEH, NADER J | — |
| 18532083 | ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING EFFECT | ANDERSON, AMARA | — |
| 18511090 | TERMINAL MODULE AND ELECTRICAL CONNECTOR WITH IMPROVED STRUCTURAL RELIABILITY | LEON MUNOZ, EDWIN A | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18896335 | CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOELECTRONIC SWITCH CHIP | SANDHU, AMRITBIR K | — |
| 18749832 | CONNECTOR ASSEMBLY WITH HEAT DISSIPATION PLATE | ALHAWAMDEH, NADER J | — |
| 18532083 | ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING EFFECT | ANDERSON, AMARA | — |
| Art Unit | Apps |
|---|---|
| 2831 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18896335 | CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOELECTRONIC SWITCH CHIP | SANDHU, AMRITBIR K | — | §103Other | Non-Final OA | — | Pending | Sep 25, 2024 |
| 18749832 | CONNECTOR ASSEMBLY WITH HEAT DISSIPATION PLATE | ALHAWAMDEH, NADER J | — | §102 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18532083 | ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING EFFECT | ANDERSON, AMARA | 2831 | §103 | Non-Final OA | — | Pending | Dec 07, 2023 |
| 18511090 | TERMINAL MODULE AND ELECTRICAL CONNECTOR WITH IMPROVED STRUCTURAL RELIABILITY | LEON MUNOZ, EDWIN A | 2831 | §102 | Non-Final OA | — | Pending | Nov 16, 2023 |
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