1 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18280918 | METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER STRUCTURE, AND METHOD FOR SHAPING BUMP | MUSLIM, SHAWN SHAW | 2897 | Final Rejection | Sep 07, 2023 |
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