Tech Center 2800 • Art Units: 2811 2897
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18467330 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18344927 | SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18395550 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18272456 | DRIVE BASE PLATE, LIGHT-EMITTING BASE PLATE, AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18530306 | SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS | Non-Final OA | International Business Machines Corporation |
| 18206730 | CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES | Non-Final OA | BAE SYSTEMS Information and Electronic Systems Integration Inc. |
| 18464182 | PACKAGING SUBSTRATE HAVING METAL POSTS | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 18202519 | SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18506033 | BIPOLAR TRANSISTOR STRUCTURE WITH BOUNDING STRUCTURE AT HORIZONTAL END AND METHODS TO FORM SAME | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18280918 | METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER STRUCTURE, AND METHOD FOR SHAPING BUMP | Final Rejection | HEFEI CHIPMORE TECHNOLOGY CO., LTD. |
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