Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2897
This examiner grants 86% of resolved cases
Shawn Shaw Muslim is an examiner in Art Unit 2811 within Tech Center 2800, having handled 84 resolved cases. The data shows an allowance rate of 85.7 percent, indicating the frequency of granted patents. The median days to allowance for these cases is 1058. Additionally, the examiner’s interview lift is 11.1 percent, suggesting that direct engagement is a strategy for applicants to consider.
The 85.7 percent allowance rate is an indicator of success for those appearing before this examiner in Art Unit 2811. Although the 84 resolved cases represent the current dataset, the 11.1 percent interview lift points to the results of oral advocacy. Applicants should prepare for a median timeline of 1058 days to allowance. This profile in Tech Center 2800 suggests that the probability of allowance is defined by these specific metrics.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18672870 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18668868 | SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18668673 | DISPLAY DEVICE | Non-Final OA | ALPS ALPINE CO., LTD. |
| 18789033 | Touch Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18589596 | PACKAGE COMPRISING A SUBSTRATE INCLUDING AN INTER SUBSTRATE INTERCONNECT STRUCTURE COMPRISING AN INNER INTERCONNECT | Final Rejection | QUALCOMM Incorporated |
| 18332918 | TWO-TERMINAL INTEGRATED CIRCUIT DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION | Non-Final OA | Intel Corporation |
| 18441094 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18422673 | SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Infineon Technologies AG |
| 18343824 | METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION | Final Rejection | Texas Instruments Incorporated |
| 18623661 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG CONNECTED TO WORD LINE | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18464182 | PACKAGING SUBSTRATE HAVING METAL POSTS | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18774102 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
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