Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2897
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18672870 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18668868 | SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18668673 | DISPLAY DEVICE | Non-Final OA | ALPS ALPINE CO., LTD. |
| 18589596 | PACKAGE COMPRISING A SUBSTRATE INCLUDING AN INTER SUBSTRATE INTERCONNECT STRUCTURE COMPRISING AN INNER INTERCONNECT | Non-Final OA | QUALCOMM Incorporated |
| 18206730 | CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES | Final Rejection | BAE SYSTEMS Information and Electronic Systems Integration Inc. |
| 18441094 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18343824 | METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION | Final Rejection | Texas Instruments Incorporated |
| 18623661 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG CONNECTED TO WORD LINE | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18506033 | BIPOLAR TRANSISTOR STRUCTURE WITH BOUNDING STRUCTURE AT HORIZONTAL END AND METHODS TO FORM SAME | Non-Final OA | GlobalFoundries U.S. Inc. |
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