Prosecution Insights
Last updated: August 16, 2026

Senju Metal Industry Co., Ltd.

8 pending office actions • 3 art units • 7 examiners • 0 of 8 (0%) have an AI response strategy ready • 21 patents granted in the last 365 days

Portfolio Summary

8
Total Pending OAs
7
Non-Final OAs
1
Final Rejections
0
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 1 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

1
Overdue
0
Due this week
0
Due this month
0
Due in next 60 days
0
Due later

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

4
Hard (50%)
3
Medium (38%)
1
Easy (12%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only3 (38%)
Double-patenting only1 (12%)
Multi-statute (no §101)4 (50%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

5
Life Sciences
62% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
0
Semiconductors
0% of docket
0
Mechanical / Eng
0% of docket
3
Business / Other
38% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

80 h
Manual time on pending OAs
16 h
Time saved (low, 20%)
28 h
Time saved (mid, 35%)
0.7 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
ROE, JESSEE RANDALL 2 76.3% +7.8%
PATEL, DEVANG R 1 65.4% +39.2%
GAMINO, CARLOS J 1 35.3% +45.6%
WANG, NICHOLAS A 1 53.8% +22.2%
CARDA, DANIELLE MARIE 1 83.5% +12.4%
TOOMER, CEPHIA D 1 74.2% +2.5%
KOSHY, JOPHY STEPHEN 1 63.5% +39.0%

Hard Cases (4)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 4 ordered by deadline are shown.

App #TitleExaminerDue in
19191151 METHOD OF PROCESSING SUBSTRATE USING JET SOLDERING APPARATUS GAMINO, CARLOS J 5d overdue
19242410 Solder Supply Method PATEL, DEVANG R
18697164 Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder Joint CARDA, DANIELLE MARIE
18568943 FLUX AND SOLDER PASTE KOSHY, JOPHY STEPHEN

Interview Candidates (5)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.

App #TitleExaminerDue in
19191151 METHOD OF PROCESSING SUBSTRATE USING JET SOLDERING APPARATUS GAMINO, CARLOS J 5d overdue
19242410 Solder Supply Method PATEL, DEVANG R
18703833 WATER-SOLUBLE FLUX AND SOLDER PASTE WANG, NICHOLAS A
18697164 Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder Joint CARDA, DANIELLE MARIE
18568943 FLUX AND SOLDER PASTE KOSHY, JOPHY STEPHEN

Top Art Units

Art UnitApps
1735 2
1759 2
1733 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
19242410 Solder Supply Method PATEL, DEVANG R 1735 §103§112 Non-Final OA Pending Jun 18, 2025
19191151 METHOD OF PROCESSING SUBSTRATE USING JET SOLDERING APPARATUS GAMINO, CARLOS J 1735 §103§112 Final Rejection 5d overdue Pending Apr 28, 2025
18703833 WATER-SOLUBLE FLUX AND SOLDER PASTE WANG, NICHOLAS A §103 Non-Final OA Pending Apr 23, 2024
18697164 Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder Joint CARDA, DANIELLE MARIE §102§103§112 Non-Final OA Pending Mar 29, 2024
18592007 FOAM EXTINGUISHING AGENT RAW LIQUID TOOMER, CEPHIA D §103 Non-Final OA Pending Feb 29, 2024
18410205 Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device ROE, JESSEE RANDALL 1759 §103 Non-Final OA Pending Jan 11, 2024
18410462 Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device ROE, JESSEE RANDALL 1759 DP Non-Final OA Pending Jan 11, 2024
18568943 FLUX AND SOLDER PASTE KOSHY, JOPHY STEPHEN 1733 §102§103 Non-Final OA Pending Dec 11, 2023

Managing Senju Metal Industry Co., Ltd.'s Patent Portfolio?

IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.

Start Free Trial

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month