Prosecution Insights
Last updated: October 02, 2026

Examiner: GAMINO, CARLOS J

Tech Center 2800 • Art Units: 1735 1793 2812 2899

This examiner grants 35% of resolved cases

Analysis

Carlos J. Gamino is an examiner in Tech Center 2800 and Art Unit 1735. Gamino has handled 747 resolved cases, with an allowance rate of 35.3 percent. This 35.3 percent allowance rate indicates the frequency of successful outcomes for applications assigned to his docket. The 747 resolved cases provide a substantial data set for understanding the examiner's typical outcomes and procedural pace.

The impact of examiner interviews is significant in Gamino's profile. The data shows an interview lift of 45.6 percent, indicating that direct communication greatly improves the chances of obtaining a grant compared to cases without an interview. This 45.6 percent lift suggests that practitioners should actively seek interviews to resolve issues and clarify claim scope. In Art Unit 1735, an interview appears to be a highly effective tool for moving a case toward allowance, especially given the baseline rate of 35.3 percent.

The median time to allowance is 1162 days. This 1162 day period is the typical duration from filing to patent issuance for successful applications. This 1162 day median indicates a moderate prosecution cycle, which applicants should account for in their strategic planning. With 747 resolved cases, this timing metric is a well-established benchmark for pendency expectations.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

35.3%
Allow Rate
-32.7% vs TC avg
792
Total Applications
+45.6%
Interview Lift
1162
Avg Prosecution Days
Based on 747 resolved cases, 2023–2026

Rejection Statute Breakdown

0.4%
§101 Eligibility
16.6%
§102 Novelty
49.2%
§103 Obviousness
30.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
19262589 WIRE BONDING APPARATUS Non-Final OA Samsung Electronics Co., Ltd.
19244209 LIGHT SOLDERING DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18488842 ULTRASONIC WELDING DEVICE Final Rejection SAMSUNG SDI CO., LTD.
18588848 THERMAL COMPRESSION BONDING WITH CONTACT AREA ADJUSTMENT Non-Final OA International Business Machines Corporation
18789626 MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
18230719 DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
18535601 ULTRASONIC JOINING HORN Non-Final OA PRIME PLANET ENERGY & SOLUTIONS, INC.
17618141 FIXING A STRIP END SEGMENT OF A METAL STRIP COIL TO AN ADJACENT STRIP WINDING Non-Final OA SMS group GmbH
18998605 USE OF ONE OR MULTIPLE CAMERAS TO DO REAL-TIME SOLDER NOZZLE PROCESS ANALYZATION Non-Final OA Nordson Corporation
18569118 Exothermic Welding System Non-Final OA ERICO International Corporation
18920771 BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD Non-Final OA Niterra Materials Co., Ltd.

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