Tech Center 2800 • Art Units: 1735 1793 2812
This examiner grants 35% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19262589 | WIRE BONDING APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19244209 | LIGHT SOLDERING DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18524828 | WIRE BONDING APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18703122 | ROLL PRESS APPARATUS AND PRESSURE-BONDING METHOD | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 19399914 | SONOTRODES FOR ULTRASONICALLY WELDING A CONDUCTIVE PIN TO A WORKPIECE, ULTRASONIC WELDING SYSTEMS, AND RELATED METHODS | Non-Final OA | Kulicke and Soffa Industries, Inc. |
| 18488842 | ULTRASONIC WELDING DEVICE | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18157714 | DIFFUSION BONDING OF PURE METAL BODIES | Non-Final OA | Applied Materials, Inc. |
| 18368251 | Wire Bonding Method and Apparatus | Final Rejection | Infineon Technologies AG |
| 18756631 | WAVE HEIGHT CONTROL FOR WAVE SOLDERING | Non-Final OA | Schweitzer Engineering Laboratories, Inc. |
| 18588848 | THERMAL COMPRESSION BONDING WITH CONTACT AREA ADJUSTMENT | Non-Final OA | International Business Machines Corporation |
| 18748789 | Exothermic Welding Device | Final Rejection | ERICO International Corporation |
| 18569118 | Exothermic Welding System | Non-Final OA | ERICO International Corporation |
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