Tech Center 2800 • Art Units: 1735 1793 2812 2899
This examiner grants 35% of resolved cases
Carlos J. Gamino is an examiner in Tech Center 2800 and Art Unit 1735. Gamino has handled 747 resolved cases, with an allowance rate of 35.3 percent. This 35.3 percent allowance rate indicates the frequency of successful outcomes for applications assigned to his docket. The 747 resolved cases provide a substantial data set for understanding the examiner's typical outcomes and procedural pace.
The impact of examiner interviews is significant in Gamino's profile. The data shows an interview lift of 45.6 percent, indicating that direct communication greatly improves the chances of obtaining a grant compared to cases without an interview. This 45.6 percent lift suggests that practitioners should actively seek interviews to resolve issues and clarify claim scope. In Art Unit 1735, an interview appears to be a highly effective tool for moving a case toward allowance, especially given the baseline rate of 35.3 percent.
The median time to allowance is 1162 days. This 1162 day period is the typical duration from filing to patent issuance for successful applications. This 1162 day median indicates a moderate prosecution cycle, which applicants should account for in their strategic planning. With 747 resolved cases, this timing metric is a well-established benchmark for pendency expectations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19262589 | WIRE BONDING APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19244209 | LIGHT SOLDERING DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18488842 | ULTRASONIC WELDING DEVICE | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18588848 | THERMAL COMPRESSION BONDING WITH CONTACT AREA ADJUSTMENT | Non-Final OA | International Business Machines Corporation |
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18230719 | DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18535601 | ULTRASONIC JOINING HORN | Non-Final OA | PRIME PLANET ENERGY & SOLUTIONS, INC. |
| 17618141 | FIXING A STRIP END SEGMENT OF A METAL STRIP COIL TO AN ADJACENT STRIP WINDING | Non-Final OA | SMS group GmbH |
| 18998605 | USE OF ONE OR MULTIPLE CAMERAS TO DO REAL-TIME SOLDER NOZZLE PROCESS ANALYZATION | Non-Final OA | Nordson Corporation |
| 18569118 | Exothermic Welding System | Non-Final OA | ERICO International Corporation |
| 18920771 | BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD | Non-Final OA | Niterra Materials Co., Ltd. |
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