Listed by the USPTO as ADHIKARI DAWADI, BIPANA
Tech Center 2800 • Art Units: 2898
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18815171 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18405141 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18533912 | ORGANIC LIGHT EMITTING DEVICE | Final Rejection | LG Display Co., Ltd. |
| 17992234 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18002077 | IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18693148 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17556602 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 18561449 | SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREFOR | Final Rejection | TDK CORPORATION |
| 18402766 | ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18593038 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18205583 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18326266 | HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND RECORDING MEDIUM | Final Rejection | Tokyo Electron Limited |
| 18090841 | SOLID-STATE IMAGE SENSOR | Non-Final OA | TOPPAN Inc. |
| 17845232 | PIXEL AND DISPLAY DEVICE | Final Rejection | STMicroelectronics (Grenoble 2) SAS |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18526473 | CONTACT GATE ISOLATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17817025 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17965888 | TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CONDUCTIVE PADS OF THE SEMICONDUCTOR DIE | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 17809701 | METHOD OF PROCESSING WAFER | Non-Final OA | DISCO CORPORATION |
| 18461980 | TRANSISTOR WITH GATE LAYOUT, DEVICE IMPLEMENTING THE TRANSISTOR WITH OUTPUT PRE-MATCHING, AND PROCESS OF IMPLEMENTING THE SAME | Final Rejection | Macom Technology Solutions Holdings, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy91.7% of resolved applications examined by Bipana Adhikari Dawadi were allowed (12 resolved cases), compared with 80.2% across Art Unit 2898 over the last five years.
This examiner's interview lift is -20.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Bipana Adhikari Dawadi took 1,236 days on average from filing to allowance.
Bipana Adhikari Dawadi examines applications in Art Unit 2898 in Tech Center 2800 (Semiconductors, Circuits & Optics).
