Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 33% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18023030 | SEMICONDUCTOR MODULE COMPRISING A HEAT SINK | Non-Final OA | Siemens Aktiengesellschaft |
| 17798079 | POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17894614 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17653173 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18147615 | SWITCHING COMPONENT FOR A CONVERTER AND THE CONVERTER THEREOF | Final Rejection | THALES |
| 17758027 | DISPLAY PANEL AND METHOD OF FABRICATING SAME | Final Rejection | GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17848243 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING ISLAND STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18150379 | POWER MODULE THERMAL MANAGEMENT | Non-Final OA | GM GLOBAL TECHNOLOGY OPERATIONS LLC |
| 18166025 | SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18068003 | CHIP DEVICE | Final Rejection | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. |
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