Listed by the USPTO as BOEGEL, CHEVY JACOB
Tech Center 2800 • Art Units: 2812 2899
This examiner grants 89% of resolved cases
BOEGEL, CHEVY JACOB is assigned to tech center 2800 and art unit 2812. The profile covers 56 resolved cases and reports an allowance rate of 89.3%. The median days to allowance is 1149, so a favorable allowance rate does not eliminate the need to plan for a lengthy path to allowance.
The interview lift is 6.9%, which indicates a more limited association with allowance outcomes than the profile's allowance rate itself. The listed companies are Samsung Electronics Co., Ltd., BOE Technology Group Co., Ltd., and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are BIRCH STEWART KOLASCH & BIRCH, LLP, CROWE & DUNLEVY - ST, and FISH & RICHARDSON P.C. (TC). The smaller resolved-case record warrants care when using the figures for forecasting.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18439835 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18413172 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18321817 | INTEGRATED CIRCUIT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18116836 | PERPENDICULAR SHAPE ANISOTROPY DESIGN WITH DUAL SPIN FILTERING | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18790357 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18439895 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT | Final Rejection | Robert Bosch GmbH |
| 18432738 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18607551 | MULTI-SIDED LIGHT-EMITTING DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18841388 | DISPLAY MODULE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18833110 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18833203 | Display Module, Heat Dissipation Film and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18659368 | METHOD OF FORMING AN EPITAXIAL STACK AND SUBSTRATE PROCESSING APPARATUS FOR FORMING THE SAME | Final Rejection | ASM IP Holding B.V. |
| 18625980 | DIE-FIRST METALLIZATION STRUCTURE AND SUBSTRATE INTERPOSER HYBRID PACKAGE | Non-Final OA | QUALCOMM Incorporated |
| 18215748 | INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED END CAP | Non-Final OA | Intel Corporation |
| 18291466 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18329317 | METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMBLIES | Non-Final OA | Skyworks Solutions, Inc. |
| 18630525 | SEMICONDUCTOR DEVICE | Final Rejection | Rohm Co., Ltd. |
| 18389257 | FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE | Final Rejection | STMicroelectronics International N.V. |
| 18666982 | SEMICONDUCTOR STRUCTURE HAVING VERTICAL CHANNELS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18413079 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18786693 | Interconnect Structure of Semiconductor Device and Method of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18836937 | SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | MITSUMI ELECTRIC CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy89.3% of resolved applications examined by Chevy Jacob Boegel were allowed (56 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +6.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Chevy Jacob Boegel took 1,149 days on average from filing to allowance.
Chevy Jacob Boegel examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
