Tech Center 2800 • Art Units: 1713 1724 1728 1756 1794 1795 2899
This examiner grants 48% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18414681 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18362404 | WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES | Final Rejection | ASM IP Holding B.V. |
| 18332886 | TREATEMENT OF A POROUS TRANSPORT LAYER FOR USE IN AN ELECTROYLYZER | Final Rejection | The Regents of the University of California |
| 18535603 | SEPARATOR PROCESSING DEVICE FOR ELECTROCHEMICAL APPARATUS AND SPUTTERING TARGET | Non-Final OA | Kia Corporation |
| 18626738 | DELIVERY OF PULSED VOLTAGE WAVEFORMS TO IMPROVE STEP COVERAGE AND DAMAGE CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18303318 | PROCESSING KIT SHIELD | Non-Final OA | Applied Materials, Inc. |
| 18913135 | METHOD FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Tokyo Electron Limited |
| 18423391 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 18734069 | DETECTING AND ADJUSTING LAMELLA DEFORMATION | Non-Final OA | FEI COMPANY |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy