Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1724 1728 1756 1794 1795 2899
This examiner grants 48% of resolved cases
John Joseph Brayton serves in Tech Center 2800 and Art Unit 1713. The examiner has a record of 719 resolved cases. These cases result in an allowance rate of 48.3%, which indicates the frequency of grants for applications reaching a final disposition. The median days to allowance is 1412, providing a benchmark for the expected duration of the prosecution cycle. Practitioners can use the 48.3% allowance rate to assess the likelihood of a successful outcome when an application is assigned to this examiner.
The data shows an interview lift of 22.4%. This lift suggests that interviews are an effective tool for communication, potentially improving the 48.3% allowance rate. The 1412-day median to allowance reflects the pace of the examination process in Art Unit 1713. Practitioners should consider these metrics when advising clients on the timeline and probability of grant. The consistency seen across 719 resolved cases offers a predictable environment for patent prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18747933 | PLASMA GENERATION CIRCUIT AND SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18362404 | WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES | Non-Final OA | ASM IP Holding B.V. |
| 18346608 | SEMICONDUCTOR PROCESSING APPARATUS FOR PROCESSING A PLURALITY OF SUBSTRATES WITH CROSS FLOW | Non-Final OA | ASM IP Holding, B.V |
| 18332886 | TREATEMENT OF A POROUS TRANSPORT LAYER FOR USE IN AN ELECTROYLYZER | Non-Final OA | The Regents of the University of California |
| 18702320 | EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE WAVEFORM TO EDGE RING | Non-Final OA | Lam Research Corporation |
| 18787321 | METHODS AND SYSTEMS FOR IMPROVING PLASMA IGNITION STABILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18758212 | ETCHING APPARATUS AND METHODS OF CLEANING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18303318 | PROCESSING KIT SHIELD | Non-Final OA | Applied Materials, Inc. |
| 18913135 | METHOD FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Tokyo Electron Limited |
| 18510273 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18479986 | PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING METHOD | Final Rejection | Tokyo Electron Limited |
| 18354220 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18336634 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18336406 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PRESSURE CONTROL DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18973450 | HIGH-EFFICIENCY TARGET FOR AN ION SOURCE | Non-Final OA | Axcelis Technologies, Inc. |
| 18734069 | DETECTING AND ADJUSTING LAMELLA DEFORMATION | Non-Final OA | FEI COMPANY |
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