Tech Center 2800 • Art Units: 2835 2838
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18585360 | LIQUID COOLING HEAT DISSIPATION STRUCTURE BASED ON DUAL COOLING PATHS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18130422 | POWER SUPPLY PANEL, POWER SUPPLY STRUCTURE AND FACILITY FOR TRANSPORTING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 18162666 | SYSTEMS AND METHODS FOR COOLING AN APPARATUS HAVING BACKSIDE POWER DELIVERY COMPONENTS | Final Rejection | Advanced Micro Devices, Inc. |
| 18706779 | HOUSING FOR RECEIVING AN ELECTRICAL HEAT SOURCE | Non-Final OA | Phoenix Contact GmbH & Co. KG |
| 18374795 | MODULAR WIRELESS CHARGING TRANSMITTER ASSEMBLY SYSTEM | Final Rejection | Aptiv Technologies (2) S.à r.l. |
| 18240508 | COOLING SYSTEMS AND METHODS FOR SERVER RACKS IN DATA CENTERS | Non-Final OA | MAGCALE, ARNOLD CASTILLO |
| 18034596 | CELL RETAINER ASSEMBLY AND METHOD THEREOF | Non-Final OA | EXICOM TELE-SYSTEMS LIMITED |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy