Prosecution Insights
Last updated: October 02, 2026

Examiner: CHAN, LAUREEN

Tech Center 1700 • Art Units: 1713 1715 1716 1717

This examiner grants 58% of resolved cases

Analysis

Laureen Chan is an examiner in Tech Center 1700 and Art Unit 1713. The examiner has 238 resolved cases with an allowance rate of 57.6%. This 57.6% rate shows that a majority of applications are successful, though the process may require careful navigation. The 238 resolved cases provide a solid statistical foundation for planning prosecution strategy.

The interview lift of 54.5% is remarkably high and should be a central part of any applicant's strategy. This 54.5% lift indicates that an interview more than doubles the effectiveness of the prosecution compared to the baseline. The median days to allowance is 1279, which defines the typical duration for reaching a grant. Practitioners should prepare for a 1279-day timeline and prioritize an interview to leverage the 54.5% lift. Given the 57.6% allowance rate, the high lift suggests that the examiner is very receptive to verbal arguments and collaborative problem-solving.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

57.6%
Allow Rate
-7.4% vs TC avg
277
Total Applications
+54.5%
Interview Lift
1279
Avg Prosecution Days
Based on 238 resolved cases, 2023–2026

Rejection Statute Breakdown

0.6%
§101 Eligibility
15.3%
§102 Novelty
55.7%
§103 Obviousness
25.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18227226 CHAMBER FOR SUBSTRATE BACKSIDE AND BEVEL DEPOSITION Final Rejection Applied Materials, Inc.
18207042 HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE, ELECTROSTATIC CHUCK, AND EMBEDDED GROUND ELECTRODE Final Rejection Applied Materials, Inc.
18750539 PLASMA PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
18120050 UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
18416802 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Final Rejection EUGENE TECHNOLOGY CO., LTD.

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