Prosecution Insights
Last updated: May 29, 2026

Examiner: CHAN, LAUREEN

Tech Center 1700 • Art Units: 1715 1716

This examiner grants 58% of resolved cases

Performance Statistics

58.1%
Allow Rate
-6.9% vs TC avg
274
Total Applications
+54.7%
Interview Lift
1280
Avg Prosecution Days
Based on 236 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
2.8%
§102 Novelty
84.8%
§103 Obviousness
7.5%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18523234 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Final Rejection SAMSUNG ELECTRONICS CO., LTD.
17880588 PLASMA PROCESSING DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING THE SAME Non-Final OA Samsung Display Co., LTD.
18376524 LIQUID-SOURCE PRECURSOR DELIVERY SYSTEM APPARATUS AND METHOD OF USING SAME Non-Final OA ASM IP Holding B.V.
18773943 BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE Non-Final OA Applied Materials, Inc.
18484352 RESISTANT COATINGS INCLUDING POLYMER SEALANT AND RESISTANT PARTICLES Final Rejection Applied Materials, Inc.
18227226 CHAMBER FOR SUBSTRATE BACKSIDE AND BEVEL DEPOSITION Non-Final OA Applied Materials, Inc.
18107157 Electrostatic Chuck Final Rejection Applied Materials, Inc.
17991651 PLASMA GENERATOR FOR EDGE UNIFORMITY Final Rejection Applied Materials, Inc.
17545618 SCANNING RADICAL SENSOR USABLE FOR MODEL TRAINING Non-Final OA Applied Materials, Inc.
17023186 PLASMA CHAMBER WITH A MULTIPHASE ROTATING MODULATED CROSS-FLOW Non-Final OA Applied Materials, Inc.
18789306 EXTERNAL MAGNETIC FIELD-COUPLED PLASMA ATOMIC LAYER DEPOSITION DEVICE AND ATOMIC LAYER DEPOSITION METHOD Final Rejection Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
18442022 PLASMA PROCESSING APPARATUS, PLASMA STATE DETECTION METHOD, AND PLASMA STATE DETECTION PROGRAM Non-Final OA TOKYO ELECTRON LIMITED
18303485 SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE SUPPORT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD Final Rejection Tokyo Electron Limited
18120050 UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
17854944 FILM FORMING APPARATUS AND FILM FORMING METHOD Non-Final OA Tokyo Electron Limited
17644412 DEPOSITION APPARATUS AND DEPOSITION METHOD Non-Final OA Tokyo Electron Limited
18637111 ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION Non-Final OA Lam Research Corporation
18032154 COLD EDGE LOW TEMPERATURE ELECTROSTATIC CHUCK Final Rejection Lam Research Corporation
17959052 SEMICONDUCTOR APPARATUS AND GAS DISTRIBUTOR OF SEMICONDUCTOR APPARATUS Non-Final OA BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
17471728 FIXTURE COMPRISING MAGNETIC MEANS FOR HOLDING ROTARY SYMMETRIC WORKPIECES Final Rejection Oerlikon Surface Solutions AG, Pfaffikon

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