Listed by the USPTO as CHANG, SUKWOO JAMES
Tech Center 3700 • Art Units: 1718 3647 3723 3745 3799
This examiner grants 58% of resolved cases
CHANG, SUKWOO JAMES is assigned to tech center 3700 and art unit 1718, with 119 resolved cases. The profile shows a 58.0% allowance rate and a median of 1066 days to allowance. The case volume is smaller than a large established docket, so the figures are useful as directional indicators rather than a complete picture of prosecution behavior.
The interview lift is 41.8%, indicating a strong association between interviews and allowance outcomes in the recorded matters. Listed companies include Ebara, Irobot, and Taiwan Semiconductor Manufacturing Company. The leading firms are Maschoff Brennan Gilmore Israelsen & Mauriel, BakerHostetler, and JCIPRNET. Counsel may therefore give particular attention to interview timing and preparation while maintaining a careful written record.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18427486 | CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18732951 | Handheld power tool, in particular a sander, handheld power tool device, protective device, handheld power tool system, and method for manufacturing a handheld power tool device | Non-Final OA | Robert Bosch GmbH |
| 17902222 | Blower With Electrostatic Discharge System | Final Rejection | Black & Decker, Inc. |
| 17952575 | BOARDING SWEEPER | Final Rejection | HONDA MOTOR CO., LTD. |
| 18215324 | DEVICE BASE, WATER STORAGE DEVICE AND CLEANING ROBOT | Non-Final OA | BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. |
| 18725438 | SELF-CLEANING DUST COLLECTION HOLDER, AND DUST COLLECTION SYSTEM | Non-Final OA | Beijing Roborock Technology Co., Ltd. |
| 18417304 | APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL | Final Rejection | Applied Materials, Inc. |
| 18182406 | WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 16549153 | Novel CMP Pad Design and Method of Using the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18359180 | Novel CMP Pad Design and Method of Using the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18982346 | SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD | Final Rejection | EBARA CORPORATION |
| 18475188 | POLISHING APPARATUS | Non-Final OA | EBARA CORPORATION |
| 18237263 | POLISHING HEAD SYSTEM AND POLISHING METHOD | Non-Final OA | EBARA CORPORATION |
| 18223326 | POLISHING METHOD AND POLISHING APPARATUS | Non-Final OA | EBARA CORPORATION |
| 18075439 | SUBSTRATE CLEANING DEVICE AND SUBSTRATE POLISHING DEVICE | Non-Final OA | EBARA CORPORATION |
| 18363939 | WORKPIECE PROCESSING METHOD | Final Rejection | DISCO CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy58.0% of resolved applications examined by Sukwoo James Chang were allowed (119 resolved cases), compared with 35.5% across Art Unit 1718 over the last five years.
This examiner's interview lift is +41.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Sukwoo James Chang took 1,066 days on average from filing to allowance.
Sukwoo James Chang examines applications in Art Unit 1718 in Tech Center 3700 (Medical Devices & Mechanical Engineering).
