Listed by the USPTO as CHU, JOHN S Y
Tech Center 2800 • Art Units: 1722 1737 1752 1795 2881
This examiner grants 77% of resolved cases
CHU, JOHN S Y has resolved 981 cases in Tech Center 2800 and Art Unit 1722. The allowance rate is 76.8%, and the median time to allowance is 1075 days. The substantial resolved portfolio shows allowance in a majority of cases, with a median prosecution period that calls for continued management after initial examination.
The interview lift is 5.4%, indicating a modest measured association with allowance. The leading companies are Shin-Etsu Chemical Co., Ltd., Fujifilm Corporation, and Samsung Electronics Co., Ltd. The leading firms are WHDA, LLP, SUGHRUE MION, PLLC, and Knobbe, Martens, Olson & Bear, LLP. Counsel may emphasize disciplined written prosecution while using interviews selectively to resolve focused issues.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18214200 | PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND KIT | Non-Final OA | FUJIFILM Corporation |
| 18059198 | ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD | Non-Final OA | FUJIFILM Corporation |
| 17946148 | PHOTOSENSITIVE MATERIAL, TRANSFER FILM, MANUFACTURING METHOD OF CIRCUIT WIRING, MANUFACTURING METHOD OF TOUCH PANEL, AND PATTERN FORMING METHOD | Final Rejection | FUJIFILM Corporation |
| 17902404 | TRANSFER FILM, PHOTOSENSITIVE MATERIAL, PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND MANUFACTURING METHOD OF TOUCH PANEL | Final Rejection | FUJIFILM Corporation |
| 18212913 | PHOTORESIST COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18098233 | PHOTOSENSITIVE POLYMER CAPABLE OF MULTI-STEP DEPROTECTION REACTION, PHOTORESIST COMPOSITION INCLUDING THE PHOTOSENSITIVE POLYMER, AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17938338 | PHOTORESIST COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17721852 | PHOTORESIST COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17935185 | PHOTOSENSITIVE STRUCTURAL BODY AND METHOD OF PRODUCING THE PHOTOSENSITIVE STRUCTURAL BODY, AND INKJET RECORDING HEAD | Final Rejection | CANON KABUSHIKI KAISHA |
| 18554651 | HYDROPHOBIC CROSSLINKABLE PINNING UNDERLAYERS WITH IMPROVED DRY ETCH CAPABILITIES FOR PATTERNING DIRECTED SELF-ASSEMBLY OF PS-B-PMMA TYPE BLOCK COPOLYMERS | Non-Final OA | Merck Patent GmbH |
| 17909999 | NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION COMPRISING REFLECTANCE MODIFIER | Non-Final OA | Merck Patent GmbH |
| 18147472 | LIGHT RESPONSIVE PHOTORESISTS AND METHODS | Non-Final OA | Intel Corporation |
| 18005594 | PHOTORESISTS FROM SN(II) PRECURSORS | Non-Final OA | Lam Research Corporation |
| 18379860 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18244370 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, AND COLOR FILTER | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 17950685 | HIGH RESOLUTION LATENT IMAGE PROCESSING, CONTRAST ENHANCEMENT AND THERMAL DEVELOPMENT | Non-Final OA | Tokyo Electron Limited |
| 18635945 | Resist Material, Resist Composition, And Patterning Process | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18404506 | ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18229880 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18271908 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18200892 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18095235 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 17545062 | ALCOHOL COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18379106 | EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION | Non-Final OA | Applied Materials, Inc. |
| 17726036 | PHOTORESIST COMPOSITION WITH NOVEL SOLVENT | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18093537 | ADDITIVES FOR METALLIC PHOTORESIST | Non-Final OA | Taiwan Semiconductor Manufacturing Company |
| 17429015 | FLEXOGRAPHIC PRINTING RAW PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Non-Final OA | ASAHI KASEI KABUSHIKI KAISHA |
| 18291075 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Non-Final OA | Resonac Corporation |
| 18487617 | METHOD OF FORMING LINE PATTERN IN SEMICONDUCTOR DEVICE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18256899 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy76.8% of resolved applications examined by John S Y Chu were allowed (981 resolved cases), compared with 60.4% across Art Unit 1722 over the last five years.
This examiner's interview lift is +5.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by John S Y Chu took 1,075 days on average from filing to allowance.
John S Y Chu examines applications in Art Unit 1722 in Tech Center 2800 (Semiconductors, Circuits & Optics).
