Listed by the USPTO as DESAI, ANISH P
Tech Center 1700 • Art Units: 1745 1746 1763 1787 1788 1794
This examiner grants 46% of resolved cases
DESAI, ANISH P works in Tech Center 1700 and Art Unit 1745. The profile covers 736 resolved cases, with a 45.5% allowance rate and a median of 1384 days to allowance. The 6.1% interview lift is relatively limited in the reported data, so interviews may be useful but do not substantially change the overall outcome pattern.
The listed companies are NITTO DENKO Corporation, Sika Technology AG, and Samsung Electronics Co., Ltd. The listed firms are GREENBLUM & BERNSTEIN, P.L.C., BIRCH STEWART KOLASCH & BIRCH, LLP, and HAUPTMAN HAM, LLP. The combination of a lower allowance rate and lengthy median timeline supports early attention to claim scope, amendment strategy, and prosecution budgeting.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19056506 | MULTILAYER STRUCTURE, EXTERIOR COVER OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18851685 | ADHESIVE COMPOSITION | Final Rejection | SHIN-ETSU POLYMER CO., LTD. |
| 18707516 | OPTICAL DISPLAY DEVICE AND ADHESIVE FILM TO BE INCLUDED THEREIN | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 19080085 | FLUORINE ATOM CONTAINING SILANE COMPOUND | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18635166 | ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF | Non-Final OA | FURUKAWA ELECTRIC CO., LTD. |
| 18874636 | A BARRIER FILM FOR A PACKAGING MATERIAL AND A PACKAGING MATERIAL | Non-Final OA | Stora Enso OYJ |
| 18201793 | ADHESIVE, ADHESIVE FOR BONDING DISSIMILAR MATERIALS, ADHESIVE SHEET, AND ADHESIVE SHEET FOR BONDING DISSIMILAR MATERIALS | Final Rejection | MITSUBISHI CHEMICAL CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy45.5% of resolved applications examined by Anish P Desai were allowed (736 resolved cases), compared with 56.6% across Art Unit 1745 over the last five years.
This examiner's interview lift is +6.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Anish P Desai took 1,384 days on average from filing to allowance.
Anish P Desai examines applications in Art Unit 1745 in Tech Center 1700 (Chemistry & Materials).
