Listed by the USPTO as DINH, TUAN T
Tech Center 3600 • Art Units: 2800 2835 2841 2847 2848 3611
This examiner grants 79% of resolved cases
DINH, TUAN T is assigned to Tech Center 3600 and Art Unit 2800. The profile includes 1202 resolved cases, a 78.9% allowance rate, and a median of 1064 days to allowance. The 22.0% interview lift is a meaningful feature of the record, indicating that interviews are associated with improved allowance outcomes.
Major companies in the profile are Intel Corporation, Samsung Electronics Co., Ltd., and Mitsui Mining & Smelting Co., Ltd. The leading firms are FOLEY & LARDNER LLP, GREENBLUM & BERNSTEIN, P.L.C., and NIXON & VANDERHYE PC. Practitioners may want to preserve interview opportunities while also planning for a prosecution timeline extending beyond the median allowance period.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18938533 | FLEXIBLE DISPLAY AND ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18937936 | ELECTRONIC DEVICE INCLUDING SUBSTRATE INCLUDING COATING LAYER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18749099 | APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18668184 | Control Device, in particular Steering Control Device | Final Rejection | Robert Bosch GmbH |
| 18724156 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18863441 | CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | Non-Final OA | HONOR DEVICE CO., LTD. |
| 18875170 | MECHANICAL COMPONENT FOR ELECTRICAL CONTACT, AND CORRESPONDING CONTROL MODULE AND MOTOR-FAN ASSEMBLY | Non-Final OA | VALEO SYSTEMES THERMIQUES |
| 18327100 | Modular Printed Circuit Boards with Connectors | Final Rejection | Intel Corporation |
| 18117818 | INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT | Final Rejection | Intel Corporation |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | Non-Final OA | Intel Corporation |
| 18937697 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD | Non-Final OA | TDK Corporation |
| 17429909 | ELECTROSTATIC CHUCK WITH POWDER COATING | Non-Final OA | Lam Research Corporation |
| 19019995 | SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18716188 | POWER SUPPLY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18632413 | Plateable Single Layer Capacitor | Final Rejection | KYOCERA AVX Components Corporation |
| 18459419 | POWER CONVERSION MODULE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18378810 | FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES | Final Rejection | Meta Platforms Technologies, LLC |
| 18797085 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18708255 | MODULE, IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD OF MODULE, AND WIRING BOARD | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18636337 | TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMATION HANDLING SYSTEMS | Non-Final OA | Dell Products L.P. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy78.9% of resolved applications examined by Tuan T Dinh were allowed (1,202 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +22.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Tuan T Dinh took 1,064 days on average from filing to allowance.
Tuan T Dinh examines applications in Art Unit 2800 in Tech Center 3600 (Transportation, E-Commerce & Mechanical Systems).
