Tech Center 1700 • Art Units: 1712 1716 1792
This examiner grants 33% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18303833 | METHOD OF FABRICATING AN ELECTRODE STRUCTURE AND APPARATUS FOR FABRICATING THE ELECTRODE STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18131552 | SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE TRANSFER ROBOT | Non-Final OA | ASM IP Holding B.V. |
| 17872498 | Equipment For Manufacturing Light-Emitting Device and Light-Receiving Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18538100 | CHAMBER AND METHODS FOR DOWNSTREAM RESIDUE MANAGEMENT | Non-Final OA | Applied Materials, Inc. |
| 18239988 | In-Vacuum Rotatable RF Component | Non-Final OA | Applied Materials, Inc. |
| 18168168 | PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGSTEN GROWTH INCUBATION DELAY | Non-Final OA | Applied Materials, Inc. |
| 17690193 | Integrated CMOS Source Drain Formation With Advanced Control | Non-Final OA | Applied Materials, Inc. |
| 18106036 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17933189 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17114096 | FURNACE WITH METAL FURNACE TUBE | Non-Final OA | Tokyo Electron Limited |
| 16580232 | VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCESSING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 17692688 | SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18017208 | THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING | Non-Final OA | LAM RESEARCH CORPORATION |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | Non-Final OA | Lam Research Corporation |
| 17936819 | TREATMENT APPARATUS FOR TREATING WORKPIECE | Non-Final OA | DISCO CORPORATION |
| 16329788 | APPARATUS AND METHODS FOR ATOMIC LAYER DEPOSITION | Non-Final OA | PICOSUN OY |
| 17908902 | SUBSTRATE PROCESSING DEVICE | Final Rejection | JUSUNG ENGINEERING CO., LTD. |
| 17400271 | SUBSTRATE TREATING APPARATUS | Final Rejection | PSK INC. |
| 18248455 | AN ATOMIC LAYER DEPOSITION APPARATUS AND A METHOD | Non-Final OA | BENEQ OY |
| 15929378 | INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLING | Final Rejection | INTEVAC, INC. |
| 18136461 | VAPOR PHASE GROWTH APPARATUS | Non-Final OA | NuFlare Technology, Inc. |
| 18359953 | FOCUS RING AND PLASMA ETCHING APPARATUS COMPRISING THE SAME | Final Rejection | Solmics Co., Ltd. |
| 18454350 | Device for the Thermal Processing of Metallurgy Parts | Non-Final OA | TAT TECHNOLOGIES |
| 16004621 | Methods and System for the Integrated Synthesis, Delivery, and Processing of Source Chemicals for Thin Film Manufacturing | Non-Final OA | Gelest, Inc. |
| 17994985 | Transfer Position for Workpieces and Replaceable Parts in a Vacuum Processing Apparatus | Non-Final OA | Mattson Technology, Inc. |
| 16292238 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | Final Rejection | EUGENE TECHNOLOGY CO., LTD. |
| 15215143 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Brooks Automation, Inc. |
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