Tech Center 1700 • Art Units: 1712 1716 1718 1792
This examiner grants 32% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18303833 | METHOD OF FABRICATING AN ELECTRODE STRUCTURE AND APPARATUS FOR FABRICATING THE ELECTRODE STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17522461 | ETCHING DEVICE AND ETCHING METHOD USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17948674 | SYSTEM AND APPARATUS FOR GAS DISTRIBUTION | Non-Final OA | ASM IP Holding, B.V. |
| 17739493 | CVD APPARATUS AND FILM FORMING METHOD | Non-Final OA | ASM IP Holding B.V. |
| 19201318 | PLUMBING FIXTURE FINISH | Non-Final OA | Kohler Co. |
| 17872498 | Equipment For Manufacturing Light-Emitting Device and Light-Receiving Device | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18387649 | PROCESS CHAMBER WITH PRESSURE CHARGING AND PULSING CAPABILITY | Non-Final OA | Applied Materials, Inc. |
| 18223183 | SINGLE PIECE OR TWO PIECE SUSCEPTOR | Final Rejection | Applied Materials, Inc. |
| 18095262 | MODULAR PRECURSOR DELIVERY AND SPLITTING FOR FAST SWITCHING | Final Rejection | Applied Materials, Inc. |
| 18674349 | Remote Plasma Device and Plasma Processing Apparatus | Non-Final OA | Tokyo Electron Limited |
| 17950116 | SUBSTRATE PROCESSING SYSTEM | Final Rejection | Tokyo Electron Limited |
| 17522191 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17114096 | FURNACE WITH METAL FURNACE TUBE | Non-Final OA | Tokyo Electron Limited |
| 17692688 | SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 18011707 | DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST | Final Rejection | Lam Research Corporation |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | Non-Final OA | Lam Research Corporation |
| 17774521 | FREQUENCY BASED IMPEDANCE ADJUSTMENT IN TUNING CIRCUITS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17419841 | METAL ATOMIC LAYER ETCH AND DEPOSITION APPARATUSES AND PROCESSES WITH METAL-FREE LIGANDS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17936819 | TREATMENT APPARATUS FOR TREATING WORKPIECE | Non-Final OA | DISCO CORPORATION |
| 18742079 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TRANSPORTING METHOD | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18136461 | VAPOR PHASE GROWTH APPARATUS | Final Rejection | NuFlare Technology, Inc. |
| 15215143 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Brooks Automation, Inc. |
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