Prosecution Insights
Last updated: October 02, 2026

Examiner: FORD, NATHAN K

Tech Center 1700 • Art Units: 1712 1716 1718 1792

This examiner grants 33% of resolved cases

Analysis

Nathan K. Ford is a patent examiner in Tech Center 1700 and Art Unit 1712. He has reached a resolution in 674 cases. The data shows an allowance rate of 32.8 percent for these applications. This percentage indicates that about one-third of the cases assigned to him result in a patent grant. Practitioners can use this 32.8 percent rate to understand the challenging examination environment presented by this examiner, where abandonments are common.

Interviews appear to be a highly effective strategy for this examiner, as shown by an interview lift of 35.4 percent. This metric indicates that direct communication is associated with a very large increase in the probability of allowance. An interview lift of 35.4 percent suggests that verbal negotiation is a critical tool for overcoming rejections that written responses alone may not resolve. Practitioners should prioritize scheduling an interview to improve their chances of success.

The median days to allowance for successful cases is 1605. This duration represents the middle value of the time taken from filing to the issuance of a patent. A median of 1605 days provides a specific timeline for applicants to consider when managing their expectations for a lengthy prosecution process. These metrics are based on 674 resolved cases, offering a data-grounded perspective on the examiner's historical prosecution patterns.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

32.8%
Allow Rate
-32.2% vs TC avg
726
Total Applications
+35.4%
Interview Lift
1605
Avg Prosecution Days
Based on 674 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
15.4%
§102 Novelty
58.1%
§103 Obviousness
24.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18642124 INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18303833 METHOD OF FABRICATING AN ELECTRODE STRUCTURE AND APPARATUS FOR FABRICATING THE ELECTRODE STRUCTURE Non-Final OA Samsung Electronics Co., Ltd.
18733178 MASK FRAME AND MASK ASSEMBLY HAVING THE SAME Non-Final OA Samsung Display Co., LTD.
17971829 PLASMA CVD APPARATUS WITH A BEVEL MASK WITH A PLANAR INNER EDGE Final Rejection ASM IP Holding B.V.
17948674 SYSTEM AND APPARATUS FOR GAS DISTRIBUTION Non-Final OA ASM IP Holding, B.V.
17739493 CVD APPARATUS AND FILM FORMING METHOD Non-Final OA ASM IP Holding B.V.
17872498 Equipment For Manufacturing Light-Emitting Device and Light-Receiving Device Final Rejection Semiconductor Energy Laboratory Co., Ltd.
19201318 PLUMBING FIXTURE FINISH Non-Final OA Kohler Co.
18465113 APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF TERMINAL TO ADJACENT NON-RF TERMINAL Non-Final OA Lam Research Corporation
18017208 THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING Final Rejection LAM RESEARCH CORPORATION
18011707 DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST Final Rejection Lam Research Corporation
17904005 COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW Non-Final OA Lam Research Corporation
17419841 METAL ATOMIC LAYER ETCH AND DEPOSITION APPARATUSES AND PROCESSES WITH METAL-FREE LIGANDS Non-Final OA LAM RESEARCH CORPORATION
17723372 MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18387649 PROCESS CHAMBER WITH PRESSURE CHARGING AND PULSING CAPABILITY Non-Final OA Applied Materials, Inc.
18239988 In-Vacuum Rotatable RF Component Final Rejection Applied Materials, Inc.
18223183 SINGLE PIECE OR TWO PIECE SUSCEPTOR Final Rejection Applied Materials, Inc.
18168168 PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGSTEN GROWTH INCUBATION DELAY Final Rejection Applied Materials, Inc.
18095262 MODULAR PRECURSOR DELIVERY AND SPLITTING FOR FAST SWITCHING Final Rejection Applied Materials, Inc.
18674349 Remote Plasma Device and Plasma Processing Apparatus Non-Final OA Tokyo Electron Limited
17114096 FURNACE WITH METAL FURNACE TUBE Non-Final OA Tokyo Electron Limited
17692688 SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM Final Rejection KOKUSAI ELECTRIC CORPORATION
19126547 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Non-Final OA SCREEN Holdings Co., Ltd.
18742079 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TRANSPORTING METHOD Non-Final OA SCREEN Holdings Co., Ltd.
17936819 TREATMENT APPARATUS FOR TREATING WORKPIECE Non-Final OA DISCO CORPORATION

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