Tech Center 1700 • Art Units: 1712 1716 1718 1792
This examiner grants 33% of resolved cases
Nathan K. Ford is a patent examiner in Tech Center 1700 and Art Unit 1712. He has reached a resolution in 674 cases. The data shows an allowance rate of 32.8 percent for these applications. This percentage indicates that about one-third of the cases assigned to him result in a patent grant. Practitioners can use this 32.8 percent rate to understand the challenging examination environment presented by this examiner, where abandonments are common.
Interviews appear to be a highly effective strategy for this examiner, as shown by an interview lift of 35.4 percent. This metric indicates that direct communication is associated with a very large increase in the probability of allowance. An interview lift of 35.4 percent suggests that verbal negotiation is a critical tool for overcoming rejections that written responses alone may not resolve. Practitioners should prioritize scheduling an interview to improve their chances of success.
The median days to allowance for successful cases is 1605. This duration represents the middle value of the time taken from filing to the issuance of a patent. A median of 1605 days provides a specific timeline for applicants to consider when managing their expectations for a lengthy prosecution process. These metrics are based on 674 resolved cases, offering a data-grounded perspective on the examiner's historical prosecution patterns.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18642124 | INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18303833 | METHOD OF FABRICATING AN ELECTRODE STRUCTURE AND APPARATUS FOR FABRICATING THE ELECTRODE STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18733178 | MASK FRAME AND MASK ASSEMBLY HAVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17971829 | PLASMA CVD APPARATUS WITH A BEVEL MASK WITH A PLANAR INNER EDGE | Final Rejection | ASM IP Holding B.V. |
| 17948674 | SYSTEM AND APPARATUS FOR GAS DISTRIBUTION | Non-Final OA | ASM IP Holding, B.V. |
| 17739493 | CVD APPARATUS AND FILM FORMING METHOD | Non-Final OA | ASM IP Holding B.V. |
| 17872498 | Equipment For Manufacturing Light-Emitting Device and Light-Receiving Device | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 19201318 | PLUMBING FIXTURE FINISH | Non-Final OA | Kohler Co. |
| 18465113 | APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF TERMINAL TO ADJACENT NON-RF TERMINAL | Non-Final OA | Lam Research Corporation |
| 18017208 | THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING | Final Rejection | LAM RESEARCH CORPORATION |
| 18011707 | DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST | Final Rejection | Lam Research Corporation |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | Non-Final OA | Lam Research Corporation |
| 17419841 | METAL ATOMIC LAYER ETCH AND DEPOSITION APPARATUSES AND PROCESSES WITH METAL-FREE LIGANDS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18387649 | PROCESS CHAMBER WITH PRESSURE CHARGING AND PULSING CAPABILITY | Non-Final OA | Applied Materials, Inc. |
| 18239988 | In-Vacuum Rotatable RF Component | Final Rejection | Applied Materials, Inc. |
| 18223183 | SINGLE PIECE OR TWO PIECE SUSCEPTOR | Final Rejection | Applied Materials, Inc. |
| 18168168 | PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGSTEN GROWTH INCUBATION DELAY | Final Rejection | Applied Materials, Inc. |
| 18095262 | MODULAR PRECURSOR DELIVERY AND SPLITTING FOR FAST SWITCHING | Final Rejection | Applied Materials, Inc. |
| 18674349 | Remote Plasma Device and Plasma Processing Apparatus | Non-Final OA | Tokyo Electron Limited |
| 17114096 | FURNACE WITH METAL FURNACE TUBE | Non-Final OA | Tokyo Electron Limited |
| 17692688 | SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 19126547 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18742079 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TRANSPORTING METHOD | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 17936819 | TREATMENT APPARATUS FOR TREATING WORKPIECE | Non-Final OA | DISCO CORPORATION |
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