Tech Center 1700 • Art Units: 1712 1716 1792
This examiner grants 32% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17749800 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18239988 | In-Vacuum Rotatable RF Component | Non-Final OA | Applied Materials, Inc. |
| 18223183 | SINGLE PIECE OR TWO PIECE SUSCEPTOR | Non-Final OA | Applied Materials, Inc. |
| 18168168 | PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGSTEN GROWTH INCUBATION DELAY | Non-Final OA | Applied Materials, Inc. |
| 17690193 | Integrated CMOS Source Drain Formation With Advanced Control | Non-Final OA | Applied Materials, Inc. |
| 17872498 | Equipment For Manufacturing Light-Emitting Device and Light-Receiving Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18106036 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18086647 | PLASMA PROCESSING APPARATUS AND GAS SUPPLY METHOD | Non-Final OA | Tokyo Electron Limited |
| 17522191 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 16580232 | VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCESSING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18522152 | LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS | Non-Final OA | ASM IP Holding B.V. |
| 17692688 | SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18017208 | THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING | Non-Final OA | LAM RESEARCH CORPORATION |
| 16329788 | APPARATUS AND METHODS FOR ATOMIC LAYER DEPOSITION | Non-Final OA | PICOSUN OY |
| 18701860 | PROCESSING CHAMBER, SEMICONDUCTOR PROCESSING EQUIPMENT, AND SEMICONDUCTOR PROCESSING METHOD | Final Rejection | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 16004621 | Methods and System for the Integrated Synthesis, Delivery, and Processing of Source Chemicals for Thin Film Manufacturing | Non-Final OA | Gelest, Inc. |
| 18136461 | VAPOR PHASE GROWTH APPARATUS | Non-Final OA | NuFlare Technology, Inc. |
| 17782169 | COATING EQUIPMENT | Non-Final OA | JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. |
| 18248455 | AN ATOMIC LAYER DEPOSITION APPARATUS AND A METHOD | Non-Final OA | BENEQ OY |
| 15929378 | INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLING | Final Rejection | INTEVAC, INC. |
| 17400271 | SUBSTRATE TREATING APPARATUS | Final Rejection | PSK INC. |
| 18454350 | Device for the Thermal Processing of Metallurgy Parts | Non-Final OA | TAT TECHNOLOGIES |
| 17016134 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | WONIK IPS CO., LTD. |
| 16292238 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | Final Rejection | EUGENE TECHNOLOGY CO., LTD. |
| 17948852 | SEMICONDUCTOR PROCESS METHOD AND MULTI-CHAMBER APPARATUS THEREWITH | Non-Final OA | HANGZHOU FULLSEMI SEMICONDUCTOR CO., LTD. |
| 15215143 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Brooks Automation, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy