Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2847
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18061109 | PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING | Non-Final OA | Intel Corporation |
| 17833568 | ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT | Non-Final OA | Intel Corporation |
| 18407677 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18720856 | PRINTED WIRING BOARD AND COIL DEVICE | Non-Final OA | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
| 18745053 | FLEXIBLE FLAT CABLE | Non-Final OA | BELLWETHER ELECTRONIC CORP. |
| 18680353 | 3D PRINTED BRIDGES FOR PRINTED INTERCONNECTS | Non-Final OA | UNIVERSITY OF MASSACHUSETTS LOWELL |
| 18674043 | FLEXIBLE CONNECTOR FOR RIGID CONDUIT AND INTEGRATED CHANNEL TO PULL WIRE | Non-Final OA | IDEAL Industries, Inc. |
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