Listed by the USPTO as HANDVILLE, BRIAN
Tech Center 3600 • Art Units: 1748 1781 1783 3642
This examiner grants 51% of resolved cases
HANDVILLE, BRIAN has resolved 556 cases in Tech Center 3600 and Art Unit 1748. The allowance rate is 51.3%, and the median time to allowance is 1259 days. The record indicates that applicants should prepare for prosecution requiring sustained claim and prior-art analysis over a lengthy timeline.
The interview lift is 28.4%, providing a measurable reason to consider interviews when written exchanges leave technical or claim-construction issues unresolved. The listed companies are LG Electronics Inc., Samsung Electronics Co., Ltd., and 3M Innovative Properties Company. The leading firms are SUGHRUE MION, PLLC, GREENBLUM & BERNSTEIN, P.L.C., and ARENTFOX SCHIFF LLP - New York.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18523349 | ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS | Non-Final OA | FUJIFILM Corporation |
| 19038299 | VACUUM ADIABATIC BODY | Non-Final OA | LG ELECTRONICS INC. |
| 18459742 | WINDOW, METHOD OF MANUFACTURING THE WINDOW, AND DISPLAY DEVICE HAVING THE WINDOW | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18282942 | RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD | Non-Final OA | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| 18233329 | MOISTURE-ABSORBING DEVICE, BATTERY AND ELECTRICAL APPARATUS | Final Rejection | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 18271060 | REINFORCING FIBER BASE MATERIAL FOR RESIN TRANSFER MOLDING, METHOD OF PRODUCING SAME, REINFORCING FIBER LAMINATE FOR RESIN TRANSFER MOLDING, AND FIBER-REINFORCED PLASTIC | Final Rejection | Toray Industries, Inc. |
| 17932099 | COMPOSITE FIBER | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 17881968 | COMPOSITE FAN BLADE AIRFOIL, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME | Non-Final OA | RTX Corporation |
| 18353471 | FLUORORESIN FILM, COPPER-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18146545 | COMPONENTS HAVING SINTERING AID-FREE COATING SYSTEMS THEREON AND METHODS FOR PRODUCING THE SAME | Final Rejection | HONEYWELL INTERNATIONAL INC. |
| 18861396 | CONDUCTIVE ADHESIVE FILM, METHOD OF TREATING ADHEREND, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | RESONAC CORPORATION |
| 19122182 | MULTILAYER FILM | Non-Final OA | Borealis AG |
| 17711466 | SYSTEM FOR FILLING VOIDS IN GLUED-IN-ROD STRUCTURES | Final Rejection | Simpson Strong-Tie Company Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy51.3% of resolved applications examined by Brian Handville were allowed (556 resolved cases), compared with 68.7% across Art Unit 1748 over the last five years.
This examiner's interview lift is +28.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Brian Handville took 1,259 days on average from filing to allowance.
Brian Handville examines applications in Art Unit 1748 in Tech Center 3600 (Transportation, E-Commerce & Mechanical Systems).
