Listed by the USPTO as LEE, AIDEN Y
Tech Center 2800 • Art Units: 1713 1718 2812
This examiner grants 48% of resolved cases
LEE, AIDEN Y works in Tech Center 2800 and Art Unit 1713. The record covers 495 resolved cases, with an allowance rate of 48.1% and a median of 1287 days to allowance. Interviews are associated with a 24.6% lift in allowance outcomes. The allowance history indicates that applications may require substantial prosecution attention, while interviews may help address obstacles.
The recorded companies are Tokyo Electron Limited, Applied Materials Inc., and Kokusai Electric Corporation. The listed firms are HARNESS, DICKEY & PIERCE, P.L.C., VOLPE KOENIG, and Xsensus. Counsel can plan for a longer prosecution path and consider interviews when technical distinctions or claim amendments would benefit from direct discussion.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18671496 | APPARATUS FOR PROCESSING A SUBSTRATE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19265339 | MASK ASSEMBLY AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 17799866 | HIGH TEMPERATURE SUBSTRATE SUPPORT WITH HEAT SPREADER | Non-Final OA | LAM RESEARCH CORPORATION |
| 18260841 | MANUFACTURING EQUIPMENT FOR LIGHT-EMITTING DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18588597 | HYDROPHOBIC TREATMENT DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18392205 | FILTER CIRCUIT AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18374679 | PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18369219 | SUBSTRATE PROCESSING METHOD, COMPONENT PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17996524 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD | Non-Final OA | Tokyo Electron Limited |
| 18280374 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18486291 | PROCESS CHAMBER GAS FLOW IMPROVEMENT | Final Rejection | Applied Materials, Inc. |
| 18222671 | SEMICONDUCTOR CHEMICAL PRECURSOR WITH GAS PASSAGES | Final Rejection | Applied Materials, Inc. |
| 18647384 | CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18172785 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18099338 | GAS SUPPLY ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, NOZZLE, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18718240 | METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TARGET LAYER | Non-Final OA | ASML NETHERLANDS B.V. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy48.1% of resolved applications examined by Aiden Y Lee were allowed (495 resolved cases), compared with 62.4% across Art Unit 1713 over the last five years.
This examiner's interview lift is +24.6 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Aiden Y Lee took 1,287 days on average from filing to allowance.
Aiden Y Lee examines applications in Art Unit 1713 in Tech Center 2800 (Semiconductors, Circuits & Optics).
