Listed by the USPTO as LEE, RIP A
Tech Center 3700 • Art Units: 1745 1762 1763 1764 1766 1787 1796 3794
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593175 | DOUBLE LAYER TUBING FOR IV INFUSION SETS | Non-Final OA | CareFusion 303, Inc. |
| 18665682 | UV/HEVL-FILTERING SILICONE HYDROGEL CONTACT LENSES | Non-Final OA | Alcon Inc. |
| 18885870 | POWDER COATING, COATING AND ARTICLE | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18446746 | COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE | Final Rejection | DAIKIN INDUSTRIES, LTD. |
| 18467201 | CONDUCTIVE ELASTOMERIC FOAM MATERIALS AND METHODS OF USE | Non-Final OA | Meta Platforms Technologies, LLC |
| 18395974 | METHOD FOR PRODUCING PERFLUORINATED COMPOUND, AND METHOD FOR PRODUCING FLUORINATED POLYMER | Non-Final OA | AGC INC. |
| 17999086 | Hybrid Catalyst Composition, Catalyst Comprising the Same, and Processes for Preparing the Same | Non-Final OA | HANWHA SOLUTIONS CORPORATION |
| 18567296 | SEMICONTINUOUS SUSPENSION POLYMERIZATION OF POLYACRYLATES IN A CAPILLARY REACTOR | Non-Final OA | Evonik Operations GmbH |
| 18686522 | COPOLYMER, PIEZOELECTRIC MATERIAL, PIEZOELECTRIC FILM, AND PIEZOELECTRIC ELEMENT | Non-Final OA | TDK CORPORATION |
| 18518613 | REACTOR APPARATUS, AND VINYL-BASED POLYMER MANUFACTURING METHOD | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18576224 | COMPOSITION BASED ON (METH)ACRYLATE MONOMERS | Non-Final OA | Centre National De La Recherche Scientifique |
| 18519762 | Guaiazulene-Based Metallocene Catalysts for Olefin Polymerization | Non-Final OA | ExxonMobil Chemical Patents Inc. |
| 18690740 | CARBON DIOXIDE ABSORBER | Non-Final OA | ZEON CORPORATION |
| 17759298 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION | Final Rejection | ZEON CORPORATION |
| 18572946 | Polyethylene composition with improved processability | Non-Final OA | BOREALIS AG |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.5% of resolved applications examined by Rip A Lee were allowed (1,380 resolved cases), compared with 56.5% across Art Unit 1745 over the last five years.
This examiner's interview lift is -4.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Rip A Lee took 955 days on average from filing to allowance.
Rip A Lee examines applications in Art Unit 1745 in Tech Center 3700 (Medical Devices & Mechanical Engineering).