Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1718 1779 1784 2875
This examiner grants 30% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18485585 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 19175324 | METHOD OF FORMING A STRUCTURE INCLUDING CARBON MATERIAL, STRUCTURE FORMED USING THE METHOD, AND SYSTEM FOR FORMING THE STRUCTURE | Non-Final OA | ASM IP Holding B.V. |
| 18642877 | SYSTEMS AND METHODS FOR DEPOSITING MATERIAL LAYERS ONTO SUBSTRATES | Non-Final OA | ASM IP Holding B.V. |
| 18598145 | METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA | Non-Final OA | ASM IP Holding B.V. |
| 18367491 | TRANSITION METAL DEPOSITION PROCESSES AND A DEPOSITION ASSEMBLY | Non-Final OA | ASM IP Holding B.V. |
| 17483541 | POROUS FILM, OPTICAL ELEMENT, OPTICAL SYSTEM, INTERCHANGEABLE LENS, OPTICAL DEVICE, AND POROUS FILM-MANUFACTURING METHOD | Non-Final OA | NIKON CORPORATION |
| 17904015 | METAL OXIDE, DEPOSITION METHOD OF METAL OXIDE, AND DEPOSITION APPARATUS FOR METAL OXIDE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18947949 | Selective metal Capping with Metal Halide enhancement | Non-Final OA | Applied Materials, Inc. |
| 18758099 | METHODS FOR SELECTIVE DEPOSITION USING SELF-ASSEMBLED MONOLAYERS | Non-Final OA | Applied Materials, Inc. |
| 17950946 | PLASMA-ENHANCED MOLYBDENUM DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 17365919 | METHOD OF DEPOSITING METAL FILMS | Final Rejection | Applied Materials, Inc. |
| 18672092 | METHOD FOR FORMING CARBON-CONTAINING FILM, AND METHOD FOR FORMING HARD MASK USING THE CARBON-CONTAINING FILM | Non-Final OA | Tokyo Electron Limited |
| 18589570 | BOTTOM-UP DIRECTIONAL ATOMIC LAYER DEPOSITION (ALD) | Non-Final OA | Tokyo Electron Limited |
| 18004931 | FILM FORMING METHOD AND FILM FORMING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18905713 | Substrate Processing Method, Method of Manufacturing Semiconductor Device, Non-transitory Computer-readable Recording Medium and Substrate Processing Apparatus | Final Rejection | Kokusai Electric Corporation |
| 18732442 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18616905 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Kokusai Electric Corporation |
| 18185673 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Kokusai Electric Corporation |
| 18096668 | ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVICES PREPARED BY SAME | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE |
| 17344035 | Freestanding Ultrathin Membranes and Transfer-Free Fabrication Thereof | Final Rejection | Northeastern University |
| 18847683 | REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES | Final Rejection | Lam Research Corporation |
| 18847173 | SEAM-FREE AND CRACK-FREE DEPOSITION | Non-Final OA | Lam Research Corporation |
| 18438175 | ATOMIC LAYER DEPOSITION OF GROUP FIFTEEN MATERIALS | Final Rejection | Wayne State University |
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