Listed by the USPTO as MCDONALD, RODNEY GLENN
Tech Center 1700 • Art Units: 1713 1724 1753 1756 1794 1795
This examiner grants 64% of resolved cases
MCDONALD, RODNEY GLENN is assigned to Tech Center 1700 and art unit 1713. The profile includes 1282 resolved cases, giving the results a broad operating history. Its allowance rate is 63.7%, and the median time to allowance is 1226 days, showing that successful prosecution commonly develops over an extended timeline in this docket.
The interview lift is 24.3%, linking interviews with a higher allowance outcome. For practitioners, that supports considering an interview early enough to shape the response strategy, particularly where claim interpretation or technical distinctions are central. The principal companies are Applied Materials Inc., Taiwan Semiconductor Manufacturing Company, Ltd., and Tokyo Electron Limited. The principal firms are HARNESS, DICKEY & PIERCE, P.L.C., Xsensus, and AMPACC Law Group, PLLC.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18424996 | APPARATUS FOR PROCESSING A SUBSTRATE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18520360 | PLASMA MONITORING SYSTEM | Non-Final OA | Samsung Display Co., LTD. |
| 18704173 | DEGAS SYSTEM USING INERT PURGE GAS AT CONTROLLED PRESSURE FOR A LIQUID DELIVERY SYSTEM OF A SUBSTRATE PROCESSING SYSTEM | Non-Final OA | LAM RESEARCH CORPORATION |
| 18807038 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18950748 | Substrate Processing Apparatus | Non-Final OA | Tokyo Electron Limited |
| 18887050 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18518696 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 18939220 | DUAL COLLIMATOR PHYSICAL VAPOR DEPOSITIONS PROCESSING CHAMBER | Final Rejection | Applied Materials, Inc. |
| 18799554 | DEPOSITION RING FOR PHYSICAL VAPOR DEPOSITION CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 18655748 | THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL | Non-Final OA | Applied Materials, Inc. |
| 18618937 | NON-AXISYMMETRIC GAS DIFFUSER FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18407142 | HEATERS AND PLASMA GENERATORS FOR GAS ACTIVATION, AND RELATED CHAMBER AND FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18391176 | ELECTRODE CONFIGURATIONS AND MAGNET CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATED METHODS AND APPARATUS, FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18144747 | HIGH EFFICIENCY MICROWAVE PLASMA APPLICATOR | Non-Final OA | Applied Materials, Inc, |
| 18144745 | MICROWAVE PLASMA APPLICATOR WITH REPLACEABLE DIELECTRIC PLATE | Non-Final OA | Applied Materials, Inc. |
| 18782179 | SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18417549 | PLASMA MULTI-WAFER ASHING SYSTEM | Non-Final OA | Rockwell Collins, Inc. |
| 18612425 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18436677 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18021537 | CHARGED-PARTICLE INSPECTION APPARATUS | Non-Final OA | ASML Netherlands B.V. |
| 18916864 | SHOWERHEAD ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS COMPRISING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18492149 | SUBSTRATE TREATMENT APPARATUS USING SUPERCRITICAL FLUID | Non-Final OA | SEMES CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy63.7% of resolved applications examined by Rodney Glenn Mcdonald were allowed (1,282 resolved cases), compared with 62.4% across Art Unit 1713 over the last five years.
This examiner's interview lift is +24.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Rodney Glenn Mcdonald took 1,226 days on average from filing to allowance.
Rodney Glenn Mcdonald examines applications in Art Unit 1713 in Tech Center 1700 (Chemistry & Materials).
