Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 3723 3725 4100
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18661972 | POLISHING PROCESS APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18086871 | METHOD OF POLISHING A SUBSTRATE HAVING DEPOSITED AMORPHOUS CARBON LAYER | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18281331 | PORTABLE ABRADING MACHINE | Non-Final OA | MAKITA CORPORATION |
| 17915347 | Welding Jig Micro-Cleaning Apparatus | Final Rejection | LG Energy Solution, Ltd. |
| 18467584 | SYSTEMS AND METHODS FOR MODIFYING SURFACES OF ADDITIVELY MANUFACTURED OBJECTS | Non-Final OA | Align Technology, Inc. |
| 18459129 | WAFER BACKGRINDING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18786321 | MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION SYSTEMS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780952 | SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
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