Listed by the USPTO as NGUYEN, HA S
Tech Center 2800 • Art Units: 1766 2837
This examiner grants 58% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18620558 | POLYMER, LEVELING AGENT AND PREPARATION METHOD THEREOF, ELECTROPLATING SOLUTION, AND ELECTROPLATING METHOD | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 17784128 | POLYUREA COPOLYMER | Non-Final OA | BASF SE |
| 17754080 | Melt Flowable Polyamide Composition for Shaped Articles | Final Rejection | BASF SE |
| 18430072 | FLUOROPOLYETHER COMPOUND | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18547226 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA AND MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | Non-Final OA | RESONAC CORPORATION |
| 18556282 | POLYMER COMPRISING LONG CHAIN HYDROXY ACIDS | Non-Final OA | EVONIK OPERATIONS GMBH |
| 17627728 | MULTI-BLOCK SHAPE MEMORY BIORESORBABLE POLYMERS | Non-Final OA | Evonik Operations GmbH |
| 18006476 | CHELATION CROSSLINKED POLYMERS, METHODS OF MAKING SAME, AND USES THEREOF | Final Rejection | CORNELL UNIVERSITY |
| 18503546 | PEKK MANUFACTURING PROCESS | Final Rejection | ARKEMA FRANCE |
| 17798227 | Polyamide powder and corresponding preparation method | Non-Final OA | ARKEMA FRANCE |
| 18567576 | POLYIMIDE-BASED POLYMER FILM, SUBSTRATE FOR DISPLAY DEVICE, AND OPTICAL DEVICE USING THE SAME | Non-Final OA | LG CHEM, LTD. |
| 18279173 | Graft Copolymer, Curable Resin Composition, and Adhesive Composition | Non-Final OA | LG Chem, Ltd. |
| 17755247 | UNIVERSAL PRECURSOR FOR NANOSCALE MORPHOLOGIES | Final Rejection | NewSouth Innovations Pty Limited |
| 18392095 | Catalyst Composition For A Polyester Manufacturing Process | Non-Final OA | CLARIANT INTERNATIONAL LTD |
| 18686970 | EPISULFIDE COMPOSITION, POLYMERIZABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MATERIAL | Non-Final OA | MITSUI CHEMICALS, INC. |
| 18726594 | TWO-PACK TYPE CLEAR COATING COMPOSITION | Non-Final OA | NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy58.5% of resolved applications examined by Ha S Nguyen were allowed (632 resolved cases), compared with 58.4% across Art Unit 1766 over the last five years.
This examiner's interview lift is -20.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Ha S Nguyen took 1,167 days on average from filing to allowance.
Ha S Nguyen examines applications in Art Unit 1766 in Tech Center 2800 (Semiconductors, Circuits & Optics).
