Listed by the USPTO as PAPE, ZACHARY
Tech Center 2800 • Art Units: 2835 2841
This examiner grants 72% of resolved cases
This record includes 1119 resolved cases in Tech Center 2800 and Art Unit 2835. The allowance rate is 72.5%, and the median time to allowance is 889 days. Interview lift is 19.5%, showing a positive association between recorded interviews and allowance outcomes.
The listed companies are Ovh, Huawei Technologies Co., Ltd., and Intel Corporation. The listed firms are BCF LLP, Hanley, Flight and Zimmerman, LLC, and ALSTON & BIRD LLP. Practitioners handling matters in this profile can treat interviews as a potentially useful part of prosecution strategy, while allowing for a median pendency of 889 days.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18786201 | ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18702048 | COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS | Non-Final OA | Robert Bosch GmbH |
| 18950438 | Circuit Board Module and Communication Device | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18613360 | Optical Module and Optical Communication Device | Final Rejection | Huawei Technologies Co., Ltd. |
| 18897955 | COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES | Non-Final OA | Intel Corporation |
| 17710640 | THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS | Non-Final OA | Intel Corporation |
| 18517183 | OPTIMIZED CHIP COOLING INFRASTRUCTURE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18412180 | LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES | Final Rejection | LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. |
| 18495735 | VEHICLE-MOUNTABLE DEVICE AND VEHICLE | Final Rejection | Yinwang Intelligent Technologies Co., Ltd. |
| 18703496 | MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD | Final Rejection | OMRON Corporation |
| 18618635 | EMBEDDED JET COOLING FOR SEMICONDUCTOR PRODUCTS | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18740674 | SEMICONDUCTOR DEVICE INCLUDING AN INTEGRATED WAFER LEVEL HEAT SINK WINDOW PLATE | Final Rejection | Sandisk Technologies, Inc. |
| 18652133 | THERMALLY CONDUCTIVE FOAM COOLING SYSTEM AND METHOD | Non-Final OA | Dell Products L.P. |
| 18941576 | SYSTEMS AND METHODS FOR COOLING MODULE FOR POWER CONVERSION SYSTEM FOR ELECTRIC VEHICLE | Non-Final OA | BorgWarner Inc. |
| 18941558 | SYSTEMS AND METHODS FOR COOLING MODULE FOR POWER CONVERSION SYSTEM FOR ELECTRIC VEHICLE | Non-Final OA | BorgWarner Inc. |
| 18353248 | Apparatus for Electronic Cooling on an Autonomous Device | Non-Final OA | DEKA Products Limited Partnership |
| 18857287 | THERMAL MANAGEMENT SYSTEM | Non-Final OA | SHELL USA, INC. |
| 18850331 | ELECTRONIC ENDOSCOPE PROCESSOR | Final Rejection | PENTAX MEDICAL CORPORATION |
| 18775090 | Electrical Service Adapter for Supply Side Interconnect | Final Rejection | Solaredge Technologies Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy72.5% of resolved applications examined by Zachary Pape were allowed (1,119 resolved cases), compared with 56.2% across Art Unit 2835 over the last five years.
This examiner's interview lift is +19.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Zachary Pape took 889 days on average from filing to allowance.
Zachary Pape examines applications in Art Unit 2835 in Tech Center 2800 (Semiconductors, Circuits & Optics).
