Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2829 2858 2868
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18890626 | SEMICONDUCTOR PACKAGE INSPECTION DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18628896 | SEMICONDUCTOR TEST DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 19043026 | ELECTRIC LEAKAGE DETECTION CIRCUIT | Non-Final OA | Panasonic Automotive Systems Co., Ltd. |
| 17709630 | TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES | Non-Final OA | Intel Corporation |
| 19024000 | MAGNETIC SENSOR AND SIGNAL PROCESSING CIRCUIT | Non-Final OA | TDK Corporation |
| 18954622 | SIGNAL PROCESSING CIRCUIT AND SENSOR UNIT | Non-Final OA | TDK Corporation |
| 18833967 | MAGNETIC SENSOR | Non-Final OA | TDK Corporation |
| 18424927 | CONTACT PROBE AND PROBE UNIT | Final Rejection | NHK Spring Co., Ltd. |
| 18715611 | SENSING DEVICE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18532867 | SOCKET APPARATUS FOR SECURE PLACEMENT OF CHIP PACKAGE | Final Rejection | Microsoft Technology Licensing, LLC |
| 18526083 | CHIP TESTING STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18850058 | PROBE | Final Rejection | YOKOWO CO., LTD. |
| 19062891 | Non-Intrusive, In-Situ Power Measurement Method | Non-Final OA | THE FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC. |
| 19007566 | PROBE CARD DEVICE HAVING HEAT-DISSIPATION CONFIGURATION AND GUIDE BOARD MODULE THEREOF | Final Rejection | CHUNGHWA PRECISION TEST TECH. CO., LTD. |
| 18748876 | HYBRID SHIELDING SOCKETS WITH IMPEDANCE TUNING FOR INTEGRATED CIRCUIT DEVICE TEST TOOLING | Non-Final OA | Essai, Inc. |
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