Tech Center 2800 • Art Units: 2829 2858 2868
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18532867 | SOCKET APPARATUS FOR SECURE PLACEMENT OF CHIP PACKAGE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 19126922 | FAULT DETECTION IN AN ELECTRIC DRIVE TRAIN OF A VEHICLE | Non-Final OA | McLaren Applied Limited |
| 18836196 | LIQUID-COOLED TERMINATION FOR RADIO FREQUENCY POWER MEASUREMENT | Non-Final OA | BIRD TECHNOLOGIES GROUP INC. |
| 18755313 | APPARATUS AND METHOD TO DETECT AND LOCATE A FAULT IN A SHIELDED CONDUCTOR | Non-Final OA | GE Aviation Systems Limited |
| 18004767 | PROBE OF PROBE CARD USE INCLUDING DEFORMATION REGIONS, AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | JAPAN ELECTRONIC MATERIALS CORPORATION |
| 18717410 | CONTACT PIN ASSEMBLY FOR KELVIN TEST AND KELVIN TEST DEVICE COMPRISING SAME | Non-Final OA | POINT ENGINEERING CO., LTD. |
| 18212927 | TEST PROBES AND TEST SOCKET FOR USE WITH THE SAME | Final Rejection | Hirose Electric Co., Ltd. |
| 18548872 | PROBE CARD | Non-Final OA | Kabushiki Kaisha Nihon Micronics |
| 18453354 | CONDUCTION INSPECTION JIG AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | Non-Final OA | IBIDEN CO., LTD. |
| 18634655 | Roller Tap Down Technique for Probe Arrays | Non-Final OA | FormFactor, Inc. |
| 18427076 | PROBE MOUNTING STRUCTURE AND RELIABILITY TEST SYSTEM FOR WAFER-LEVEL RELIABILITY TEST | Non-Final OA | SEMIGHT INSTRUMENTS CO., LTD |
| 18388599 | SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS | Non-Final OA | JF MICROTECHNOLOGY SDN. BHD. |
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