Tech Center 2800 • Art Units: 2814 2892
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18335186 | INTEGRATED CIRCUIT DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18554022 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17271231 | DISPLAY PANEL AND METHOD OF MANUFACTURING SAME | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 17749808 | SOLID-STATE IMAGING DEVICE WITH MICROLENS ELEMENTS AND METHOD OF PRODUCING THE SAME | Final Rejection | TOPPAN Inc. |
| 18451011 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17600403 | LIGHT EMITTING DIODE CHIP-SCALE PACKAGE WITH EXTENDED PAD AND METHOD FOR MANUFACTURING SAME | Final Rejection | AGASemicon Corp. |
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