Tech Center 2800 • Art Units: 1722 2847 2848 2884
This examiner grants 80% of resolved cases
Aditya Sharma has managed 39 resolved cases in Art Unit 1722. The examiner maintains an allowance rate of 79.5 percent. This figure provides a baseline for applicants to understand the probability of a grant in Tech Center 2800. The data shows an interview lift of 28.1 percent. This lift represents the difference in allowance rates between cases with and without interviews. Practitioners should consider this 28.1 percent lift when deciding whether to engage in direct communication.
The median days to allowance for this examiner is 994. This duration represents the timeline for reaching a final resolution for the 39 resolved cases. Applicants in Art Unit 1722 can use this 994-day metric to plan their prosecution schedules. The 79.5 percent allowance rate indicates the frequency of grants for this profile. With an interview lift of 28.1 percent, the role of the interview is a documented factor in the examiner's history. These metrics provide a view of the prosecution environment for this profile in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18746781 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18510843 | CHARGING CABLE | Non-Final OA | VOLVO PENTA CORPORATION |
| 18810911 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18462434 | CONDUCTIVE FILM AND TEST COMPONENT | Non-Final OA | Innolux Corporation |
| 18790285 | CIRCUIT BOARD AND IMAGE FORMING APPARATUS | Final Rejection | CANON KABUSHIKI KAISHA |
| 18729016 | CIRCUIT BOARD | Final Rejection | Mitsubishi Electric Corporation |
| 18837431 | LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES | Non-Final OA | Hewlett-Packard Development Company, L.P. |
| 18808203 | ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18790389 | CIRCUIT MODULE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18721448 | CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRING BOARD, PACKAGE, MICROPHONE DEVICE, AND GAS SENSOR DEVICE | Non-Final OA | KYOCERA Corporation |
| 18684334 | CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE | Non-Final OA | KYOCERA Corporation |
| 18806380 | POWER COUPLING DEVICES FOR HIGH-TEMPERATURE SUPERCONDUCTORS | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18783666 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18768907 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18771130 | Electronic Component Mounting Board | Final Rejection | ROHM CO., LTD. |
| 18772478 | COVER BOX FOR PROTECTING AN ELECTRICAL CONNECTION, ASSEMBLY, AND RELATED METHOD | Non-Final OA | Schneider Toshiba Inverter Europe SAS |
| 18693630 | Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method | Final Rejection | AT&S Austria Technologie & Systemtechnik AG |
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