Tech Center 4100 • Art Units: 1733 1735 1784 1793 3711 3725 4100
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19289627 | BONDING HEAD AND SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18596869 | SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18685781 | CALIBRATION OF A SOLDERING MACHINE | Non-Final OA | Illinois Tool Works Inc. |
| 19018244 | JOINED BODY AND JOINING METHOD | Non-Final OA | HONDA MOTOR CO., LTD. |
| 19270569 | FRICTION STIR WELDING TOOL | Non-Final OA | AISIN CORPORATION |
| 19325894 | BONDING STRENGTH INSPECTION APPARATUS AND BONDING SYSTEM | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18898289 | APPARATUS AND RELATED METHODS FOR FRICTION STIR ADDITIVE MANUFACTURING REPAIR OF MATERIALS | Final Rejection | RTX Corporation |
| 19080066 | MULTI-PIECE SOLID GOLF BALL | Non-Final OA | Bridgestone Sports Co., Ltd. |
| 18891597 | PICKLEBALL PADDLE | Non-Final OA | Wilson Sporting Goods Co. |
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