Tech Center 2800 • Art Units: 1758 2814
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18233296 | MEMORY PACKAGE EXPANSION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18232549 | ELEMENTAL DOPING OF HIGH-K DIELECTRIC OXIDE TO CREATE P-TYPE CONDUCTIVITY IN THIN LAYER CHANNELS VIA SURFACE CHARGE TRANSFER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18198418 | SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18534829 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18534736 | DISPLAY PANEL AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18505024 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18524544 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Kia Corporation |
| 18260989 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18510596 | STACKED FET POWER DELIVERY NETWORK FORMATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18365470 | CHANNEL WIDTH MODULATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18152778 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18206731 | INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE | Non-Final OA | BAE SYSTEMS Information and Electronic Systems Integration Inc. |
| 18524628 | METHOD FOR POROSIFYING (Al,In,Ga)N/(Al,In,Ga)N MESAS | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18079261 | SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE | Final Rejection | PanelSemi Corporation |
| 18536343 | METHOD OF MANUFACTURING CAPACITOR ARRAY | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18005533 | METHOD FOR PRODUCING A COMPONENT, AND OPTOELECTRONIC COMPONENT | Final Rejection | ams-OSRAM International GmbH |
| 18449062 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18397079 | SEMICONDUCTOR DEVICE INCLUDING MEMORY ELEMENTS | Non-Final OA | Unisantis Electronics Singapore Pte. Ltd. |
| 18038882 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing South China Corporation |
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