Tech Center 2800 • Art Units: 1758 2814
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18336331 | FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18580808 | LIGHT EMITTING DEVICE, DISPLAY DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR LIGHT EMITTING DEVICE | Non-Final OA | KYOCERA Corporation |
| 18151449 | CONTACT STRUCTURE AND METHOD FOR FABRICATING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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